Realities and challenges of III-V/Si integration technologies
Abstract
The complexity of photonic integrated circuits has progressed rapidly, but serious problems remain to be solved to enable widespread application in Tbps transceivers and optical scanners. A summary of progress, problems and potential solutions is provided.
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Heterogeneous integration has been applied to fabricate optoelectronic and nonlinear photonic devices on silicon substrates and on-chip waveguides, with gain, absorption and enhanced optical nonlinearities provided by III-V semiconductor materials.
“The approach has been applied in the fabrication of optoelectronic [35] and nonlinear photonic [36] devices on silicon substrates and on-chip waveguides, with gain, absorption and enhanced optical nonlinearities provided by III-V semiconductor materials.”
From 2022 Roadmap on integrated quantum photonics (2022) · cites this paper as [35]
Cites
Efficient low-loss InGaAsP/Si hybrid MOS optical modulator
Han, J.-H., Boeuf, F., Fujikata, J., Takahashi, S., Takagi, S., & Takenaka, M. (2017) · Nature Photonics · doi:10.1038/nphoton.2017.122 · Cited by 235 · see citing works
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2022 Roadmap on integrated quantum photonics
Moody, G., Sorger, V. J., Blumenthal, D. J., Juodawlkis, P. W., Loh, W., Sorace-Agaskar, C., Jones, A. E., Balram, K. C., Matthews, J. C. F., Laing, A., et al. (2022) · Journal of Physics: Photonics · doi:10.1088/2515-7647/ac1ef4 · Cited by 6 · see citing works
Self-citation
- Authors
- Bowers, J. E., Huang, D., Jung, D., Norman, J., Tran, M. A., Wan, Y., Xie, W., & Zhang, Z.
- Affiliations
- University of California, Santa Barbara (US)
- ORCID
- Venue
- Optical Fiber Communication Conference (OFC) 2019
- Publisher
- OSA
- Published
- 2019
- Pages
- Tu3E.1
- OpenAlex
- W2918038875
- Cited by
- 19
- References
- 1
- Citations by year
- 2026: 1 · 2024: 1 · 2023: 3 · 2022: 3 · 2021: 3 · 2020: 3 · 2019: 5
- FWCI
- 5.57
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- Optical Fiber Communication Conference (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Keywords
- III-V/Si integration, silicon photonics, photonic integrated circuits, optical scanner, integration challenges
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