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45nm CMOS - Silicon Photonics Monolithic Technology (45CLO) for next-generation, low power and high speed optical interconnects
Abstract
GLOBALFOUNDRIES’ monolithic 45nm CMOS-Silicon Photonics 300mm high-volume manufacturing platform based on 45nm RF technology node, and optimized for high performance and low power short-reach optical interconnects for on-chip and chip-to-chip applications will be discussed.
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“Developing a monolithic EPIC process (Fig. 4e), starting with a CMOS (or BiCMOS) SOI process and optimizing it for photonic applications, has been demonstrated several times130–132 successfully.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [132]
Citations
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References 5 · Cited by 104
Research works printed but not linked: 4
- Giewont, 2019, IEEE JSTQE, 25, 1
- Rakowski, 2018, 2018 IEEE VLSI, 10.1109/VLSIT.2018.8510668 · DOI · Paper page
- Atabaki, 2018, Volume and page. Nature, 10.1038/s41586-018-0028-z · DOI
- Ramon, 2019, Journal of Lightwave Technology, 37, 1504, 10.1109/JLT.2019.2900192 · DOI
Metadata
- Authors
- Rakowski, M., Meagher, C., Nummy, K., Aboketaf, A., Ayala, J., Bian, Y., Harris, B., Mclean, K., McStay, K., Sahin, A., Medina, L., Peng, B., Sowinski, Z., Stricker, A., Houghton, T., Hedges, C., Giewont, K., Jacob, A., Letavic, T., Riggs, D., Yu, A., & Pellerin, J.
- Affiliations
- GlobalFoundries (United States) (US)
- Venue
- Optical Fiber Communication Conference (OFC) 2020
- Publisher
- Optica Publishing Group
- Published
- 2020
- Pages
- T3H.3
- OpenAlex
- W3009691288
- Cited by
- 104
- References
- 5
- Citations by year
- 2026: 10 · 2025: 19 · 2024: 17 · 2023: 23 · 2022: 15 · 2021: 16 · 2020: 4
- FWCI
- 20.39
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- Optical Fiber Communication Conference (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Keywords
- 45 nm CMOS, silicon photonics, monolithic integration, optical interconnects, short-reach optical links, chip-to-chip interconnects, on-chip interconnects, low power consumption, high-speed interconnects, high-volume manufacturing
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