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Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing
Open accessAbstract
The aim of this study was to clarify the influence of inter-metallic compounds (IMCs) on the electrical conductivity of Cu/Al joint. The longitudinal resistance and the lateral current distribution at flash welded and diffusion brazed Cu/Al joint interfaces were investigated using four-point method and conductive atomic force microscopy, respectively. A 2μm Cu9Al4/CuAl2 layer was formed in both joints. The IMCs layer was homogenous and the current distribution interface was planar at diffusion brazed joint. However, the IMCs layer was discontinuous and the current distribution interface was non-planar at flash welded joint. After heat treatment at 350°C for 500h, the thickness of interfacial layer was increased to 50μm. CuAl and a short crack were newly formed in the diffusion brazed joint. CuAl, (Cu,Al)xOy and a long crack were newly formed in the flash welded joint. A multilayer current distribution was found at both heat treated joints. The resistivity of all Cu/Al joints was higher than that of copper and lower than that of aluminum. The resistivity of diffusion brazed joint was the lowest, which was lower than the theoretical value. The resistivity of the heat treated flash welded joint was the highest among all the joints.
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“Wang et al. [29] proposed a mechanism for the non-linear increase in resistance by relating intermetallic thickness to the base materials' grain sizes, as well as possible contributions from cracks, oxides and residual stresses.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [29]
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“Wang et al.'s [29] results exemplify the importance of the process and weld structure over intermetallic thickness measurements alone, as they reported a diffusion brazed joint with 50 μm total intermetallic thickness that had a lower resistance than a flash welded joint with 2 μm total intermetallic thickness.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [29]
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“Calculation of the weld interface resistivity for Wang et al.'s [29] diffusion brazed specimens is negative as Wang et al. reported a joint resistivity below the theoretical for the base materials.”
From Electrical and thermal stability of Al-Cu welds: Performance benchmarking of the hybrid metal extrusion and bonding process (2022) · cites this paper as [29]
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Research works printed but not linked: 29
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Cited by
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Elkjaer, A., Sørhaug, J. A., Ringen, G., Bjørge, R., & Grong, Ø. (2022) · Journal of Manufacturing Processes · doi:10.1016/j.jmapro.2022.04.029 · Cited by 23
Pilot scale production of copper clad aluminum e-motor windings through combined extrusion-rolling
Finateri, B., Williams, B., Kar, N., & Edrisy, A. (2026) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-025-17110-5
Metadata
- Authors
- Wang, X.-G., DongYuan, X., Li, J.-N., & Li, X.-G.
- Affiliations
- Shandong Jianzhu University, China
- Shandong Jianzhu University (CN)
- State Grid Corporation of China (China) (CN)
- ORCID
- Wang, Xue-Gang
- Venue
- Materials Research
- Publisher
- FapUNIFESP (SciELO)
- Published
- 2020
- Volume
- 23
- Issue
- 5
- ISSN
- 1516-1439 (ISSN-L)
- 1980-5373
- OpenAlex
- W3107245878
- Cited by
- 9
- References
- 0
- Citations by year
- 2026: 2 · 2024: 2 · 2023: 1 · 2022: 4
- FWCI
- 0.61
- Type
- journal article
- Language
- en
- Open access
- diamond
- doi.org
- Licence
- Locations
- Materials Research (publishedVersion, cc-by)
- LA Referencia (Red Federada de Repositorios Institucionales de Publicaciones Científicas) (publishedVersion, other-oa)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion, cc-by-sa)
- Funders
- Shandong Jianzhu University
- State Grid Corporation of China
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
- Keywords
- intermetallic compounds, flash welding, diffusion brazing, electrical conductivity, interfacial resistance, current distribution, Cu9Al4, CuAl2, CuAl, interfacial layer, heat treatment, joint cracking
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- CoChat. (2026). Citation check: Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing. https://app.cochat.ai/papers/10.1590/1980-5373-mr-2020-0325
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- Wang, X.-G., DongYuan, X., Li, J.-N., & Li, X.-G. (2020). Influence of Interfacial Inter-metallic Compounds on the Electrical Characterization of Cu/Al Joints Produced by Flash Welding and Diffusion Brazing. Materials Research. https://doi.org/10.1590/1980-5373-mr-2020-0325
