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Cited by 77

The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.

Review of Thermal Conductance Models for Joints Incorporating Enhancement Materials

Savija, I., Culham, J. R., Yovanovich, M. M., Marotta, E. E.·2003·Journal of Thermophysics and Heat Transfer
DOI 10.2514/2.6732
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Abstract

A comprehensive review of analytical and empirical models for calculating the thermal conductance across mechanically formed joints is presented. A historical perspective of modeling procedures for a range of interface cone gurations is presented, including barecontacting surfaces for conforming rough surfaces aswell as interfacial surfaces augmented with enhancement materials such as greases, metallic foils, polymeric compliant materials, e lms, and coatings. Given the wide range of interface materials available and their associated thermophysical and surface properties, the models presented provide an effective procedure for determining the signie cance of these properties in the prediction of contact, gap, and overall joint conductance.

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Registry

Crossref · 10.2514/2.6732

Cites

1 of 1 references verified0 citation errors · 0 not checkable

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Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

  • Interfacial thermal conductance of bulk materials is affected by surface roughness, surface hardness, impurities and cleanness, the thermal conductivity of the mating solids, and the contact pressure.

    “Interfacial thermal conductance of bulk materials is affected by several factors such as surface roughness, surface hardness, impurities and cleanness, the thermal conductivity of the mating solids and the contact pressure [1].”

    From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [1]

Citations

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Metadata

Authors
Savija, I., Culham, J. R., Yovanovich, M. M., & Marotta, E. E.
Affiliations
  • University of Waterloo, Waterloo, Ontario N2L 3G1, Canada
  • IBM Corporation, Inc., Poughkeepsie, New York 12601
Venue
Journal of Thermophysics and Heat Transfer
Publisher
American Institute of Aeronautics and Astronautics (AIAA)
Published
2003-01
Volume
17
Issue
1
Pages
43-52
ISSN
  • 0887-8722
  • 1533-6808
DOI
10.2514/2.6732
Cited by
77
References
1
Language
en

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