Contact heat transfer - The last decade
Abstract
Resistance d'une simple constriction; resistance thermique de points de contact multiples dans le vide; correlations pour la conductance de contact thermique dans le vide
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Most conventional thermal conductivity measurement techniques lack the spatial resolution to measure the temperature gradient/difference or the heat flux across a length scale below tens of microns.
“However, most of the conventional thermal conductivity measurement techniques lack the spatial resolution to measure the temperature gradient/difference or the heat flux across a length scale below tens of microns.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [20]
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On the Enhancement of the Thermal Contact Conductance: Effect of Loading History
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Self-citation
- Authors
- Madhusudana, C. V., & Fletcher, L. S.
- Affiliations
- UNSW Sydney (AU)
- Texas A&M University (US)
- Venue
- AIAA Journal
- Published
- 1986-03
- Volume
- 24
- Issue
- 3
- Pages
- 510-523
- ISSN
- 0001-1452 (ISSN-L)
- 1533-385X
- OpenAlex
- W1981396189
- Cited by
- 176
- References
- 113
- Citations by year
- 2026: 2 · 2025: 2 · 2024: 4 · 2023: 5 · 2022: 4 · 2021: 1 · 2020: 1 · 2019: 7 · 2018: 6 · 2017: 3 · 2016: 3 · 2015: 4 · 2013: 7 · 2012: 6
- FWCI
- 4.58
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- AIAA Journal (publishedVersion)
- Topics
- Physical Sciences › Mathematics › Applied Mathematics › Gas Dynamics and Kinetic Theory
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Keywords
- contact heat transfer, thermal contact resistance, constriction resistance, multiple contact points, vacuum
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