Zhang, Guoqi

Review of Die-Attach Materials for SiC High-Temperature Packaging

Hou, F., Sun, Z., Su, M., Fan, J., You, X., Li, J., Wang, Q., Cao, L., & Zhang, G. (2024) · IEEE Transactions on Power Electronics

Electronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies

Cited by 52

Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

Liu, X., Zhou, Q., Zhao, X., Koh, S. W., Ye, H., & Zhang, G. (2021) · 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Electronic Packaging and Soldering Technologies3D IC and TSV technologies

Cited by 12

Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

Chen, W., Yan, X., Ibrahim, M. S., Meda, A. H., Fan, X., Zhang, G., & Fan, J. (2023) · 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

Silicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering Technologies

Cited by 8