Roshanghias, Ali

An Introduction to Wire-Bondless Discrete GaN Power Packages With Top-Side Cu Sinterconnects®

Ain, K. N., Zhang, G. Q., Rodrigues, A., Hasan, M. N., Holzmann, D., Geens, K., Chatterjee, U., & Roshanghias, A. (2024) · 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

Silicon Carbide Semiconductor TechnologiesGaN-based semiconductor devices and materials

Cited by 2

A Fast Multidomain System-Level Simulation Model for GaN Transistor Package Optimization

Caponi, D., Grosso, G., Pradhan, A., & Roshanghias, A. (2026) · 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

GaN-based semiconductor devices and materialsSilicon Carbide Semiconductor Technologies

Cited by 0