Gaskins, John T.

Thermal conductivity and thermal boundary resistance of atomic layer deposited high- k dielectric aluminum oxide, hafnium oxide, and titanium oxide thin films on silicon

Scott, E. A., Gaskins, J. T., King, S. W., & Hopkins, P. E. (2018) · APL Materials

Thermal properties of materialsSemiconductor materials and devices

Cited by 139

Mechanisms of nonequilibrium electron-phonon coupling and thermal conductance at interfaces

Giri, A., Gaskins, J. T., Donovan, B. F., Szwejkowski, C., Warzoha, R. J., Rodriguez, M. A., Ihlefeld, J., & Hopkins, P. E. (2015) · Journal of Applied Physics

Thermal properties of materialsThermoelastic and Magnetoelastic Phenomena

Cited by 101

Thermal boundary conductance across metal-gallium nitride interfaces from 80 to 450 K

Donovan, B. F., Szwejkowski, C. J., Duda, J. C., Cheaito, R., Gaskins, J. T., Peter Yang, C.-Y., Constantin, C., Jones, R. E., & Hopkins, P. E. (2014) · Applied Physics Letters

Thermal properties of materialsGaN-based semiconductor devices and materials

Cited by 72

Limitations and Advances in Optical Thermal Transport Measurements: Extremes in Properties, Length Scales, and Temperature

Pfeifer, T. W., Schonfeld, H. B., Scott, E. A., Aller, H. T., Gaskins, J. T., Olson, D. H., Braun, J. L., Graham, S., & Hopkins, P. E. (2025) · Annual Review of Materials Research

Thermal properties of materialsThermal Radiation and Cooling Technologies

Cited by 16