Lu, Guo-Quan

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Bai, J. G., Yin, J., Zhang, Z., Lu, G.-Q., & van Wyk, J. D. (2007) · IEEE Transactions on Advanced Packaging

Electronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies

Cited by 177

Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

Chen, G., Han, D., Mei, Y.-H., Cao, X., Wang, T., Chen, X., & Lu, G.-Q. (2012) · IEEE Transactions on Device and Materials Reliability

Electronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies

Cited by 71

Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging

Wang, M., Mei, Y.-H., Jin, J., Chen, S., Li, X., & Lu, G.-Q. (2021) · IEEE Transactions on Power Electronics

Electronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor Technologies

Cited by 69