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Cited by 436

The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.

High‐Dielectric‐Constant Silver–Epoxy Composites as Embedded Dielectrics

Qi, L., Lee, B. I., Chen, S., Samuels, W. D., Exarhos, G. J.·2005·Advanced Materials

Abstract

The incorporation of organic-coated silver nanoparticles into an epoxy matrix (see Figure, a–f represent increasing Ag content) results in a flexible 0-3 type nanocomposite with a strikingly high dielectric constant (greater than 300). The composite retains the flexibility and other mechanical properties of the polymer matrix, and may be useful in applications where capacitors are embedded into printed circuit boards.

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Crossref · 10.1002/adma.200401816

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Metadata

Authors
Qi, L., Lee, B. I., Chen, S., Samuels, W. D., & Exarhos, G. J.
Venue
Advanced Materials
Publisher
Wiley
Published
2005-07-08
Volume
17
Issue
14
Pages
1777-1781
ISSN
  • 0935-9648 (ISSN-L)
  • 1521-4095
OpenAlex
W2141562012
Cited by
436
References
2
FWCI
10.12
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: High‐Dielectric‐Constant Silver–Epoxy Composites as Embedded Dielectrics. https://app.cochat.ai/papers/10.1002/adma.200401816
The paper
Qi, L., Lee, B. I., Chen, S., Samuels, W. D., & Exarhos, G. J. (2005). High‐Dielectric‐Constant Silver–Epoxy Composites as Embedded Dielectrics. Advanced Materials. https://doi.org/10.1002/adma.200401816

Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.