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Cited by 253

The DOI matches its Crossref record; 57 of the 57 references it cites were found in a registry or an index.

Ultra‐High Electrical Conductivity in Filler‐Free Polymeric Hydrogels Toward Thermoelectrics and Electromagnetic Interference Shielding

Wang, Jing, Li, Qing, Li, Kuncai, Sun, Xu, Wang, Yizhuo, Zhuang, Tiantian, Yan, Junjie, Wang, Hong·2022·Advanced Materials

Abstract

Conducting hydrogels have attracted much attention for the emerging field of hydrogel bioelectronics, especially poly(3,4‐ethylenedioxythiophene): poly(styrene sulfonate) (PEDOT:PSS) based hydrogels, because of their great biocompatibility and stability. However, the electrical conductivities of hydrogels are often lower than 1 S cm−1 which are not suitable for digital circuits or applications in bioelectronics. Introducing conductive inorganic fillers into the hydrogels can improve their electrical conductivities. However, it may lead to compromises in compliance, biocompatibility, deformability, biodegradability, etc. Herein, a series of highly conductive ionic liquid (IL) doped PEDOT:PSS hydrogels without any conductive fillers is reported. These hydrogels exhibit high conductivities up to ≈305 S cm−1, which is ≈8 times higher than the record of polymeric hydrogels without conductive fillers in literature. The high electrical conductivity results in enhanced areal thermoelectric output power for hydrogel‐based thermoelectric devices, and high specific electromagnetic interference (EMI) shielding efficiency which is about an order in magnitude higher than that of state‐of‐the‐art conductive hydrogels in literature. Furthermore, these stretchable (strain >30%) hydrogels exhibit fast self‐healing, and shape/size‐tunable properties, which are desirable for hydrogel bioelectronics and wearable organic devices. The results indicate that these highly conductive hydrogels are promising in applications such as sensing, thermoelectrics, EMI shielding, etc.

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Metadata

Authors
Wang, J., Li, Q., Li, K., Sun, X., Wang, Y., Zhuang, T., Yan, J., & Wang, H.
Venue
Advanced Materials
Publisher
Wiley
Published
2022-02-10
Volume
34
Issue
12
Pages
e2109904-e2109904
ISSN
  • 0935-9648 (ISSN-L)
  • 1521-4095
OpenAlex
W4207022868
Cited by
253
References
57
FWCI
17.12
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Ultra‐High Electrical Conductivity in Filler‐Free Polymeric Hydrogels Toward Thermoelectrics and Electromagnetic Interference Shielding. https://app.cochat.ai/papers/10.1002/adma.202109904
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Wang, J., Li, Q., Li, K., Sun, X., Wang, Y., Zhuang, T., Yan, J., & Wang, H. (2022). Ultra‐High Electrical Conductivity in Filler‐Free Polymeric Hydrogels Toward Thermoelectrics and Electromagnetic Interference Shielding. Advanced Materials. https://doi.org/10.1002/adma.202109904

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