Thermomechanical studies of aluminum nitride filled shape memory polymer composites
Abstract
Abstract High thermal conductivity polyurethane shape memory polymer (SMP) composites filled with aluminum nitride (AlN) were fabricated, and their thermal and thermomechanical properties were studied. The purpose of this microstructure is to improve the thermal properties of the SMPs at low filler content. Morphology of AlN filler in polyurethane SMP matrix and the resulting thermal conductivity was also investigated. Thermal studies have shown that AlN is an effective filler for reinforcement of the polyurethane SMP and that it does not deteriorate the stable physical crosslink structure of the polyurethane, which is necessary to store the elastic energy in the service process of the shape memory material. The thermal conductivities of these SMP composites in relation to filler concentration and temperature were investigated, and it was found that the thermal conductivity can increase up to 50 times in comparison with that of the pure SMP. Furthermore, differential scanning calorimetry tests have shown a significant decrease in the glass transition temperature of the switching segment. Dynamic mechanical studies have shown that the storage modulus of the composites increase with higher AlN content in both glassy and rubbery state. Damping peak decreases and also the curve of damping becomes broader with increasing filler content. Strain fixity rate which expresses the ability of the specimens to fix their strain has been improved slightly in the presence of AlN filler but the final recovery rate of the shape memory measurement has decreased evidently. POLYM. COMPOS., 28:287–293, 2007. © 2007 Society of Plastics Engineers
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Loading ether-based SMPU with 40 wt% AlN increases thermal conductivity from 0.12 to 0.44 W/mK.
“loading an ether-based SMPU from Diaplex Co., Ltd. with 40 wt% AlN particles increases the thermal conductivity from 0.12 to 0.44 W/mK.”
From Review on the Functional Determinants and Durability of Shape Memory Polymers (2010) · cites this paper as [199]
In AlN-filled SMPU, transition temperature fell from 51 to 45 °C as confirmed by DSC.
“The lowering of transition temperature was confirmed by DSC; T g fell from 51 to 45 °C.”
From Review on the Functional Determinants and Durability of Shape Memory Polymers (2010) · cites this paper as [199]
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- Authors
- Razzaq, M. Y., & Frormann, L.
- Affiliations
- Clausthal University of Technology (DE)
- Corresponding author
- Frormann, Lars
- Venue
- Polymer Composites
- Publisher
- Wiley
- Published
- 2007-05-04
- Volume
- 28
- Issue
- 3
- Pages
- 287-293
- ISSN
- 0272-8397 (ISSN-L)
- 1548-0569
- OpenAlex
- W2077311281
- Cited by
- 52
- References
- 26
- Citations by year
- 2026: 2 · 2025: 2 · 2024: 1 · 2023: 2 · 2021: 4 · 2020: 2 · 2019: 1 · 2018: 4 · 2017: 3 · 2016: 5 · 2015: 1 · 2014: 1 · 2013: 4 · 2012: 3
- FWCI
- 2.79
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Polymer Composites (publishedVersion)
- Topics
- Physical Sciences › Materials Science › Polymers and Plastics › Polymer composites and self-healing
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Materials and Mechanics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Keywords
- shape memory polymers, polyurethane, aluminum nitride filler, thermal conductivity, thermomechanical properties, glass transition temperature, storage modulus, damping, shape recovery, crosslink structure
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