The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.
Characterization Methodologies of Thermal Management Materials
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In the laser flash method, the rear-side infrared radiation thermometer should be fast enough to respond to the emitting signals, and the precision of temperature calibration is usually ±0.2 K.
“The rear-side infrared radiation thermometer should be fast enough to respond to the emitting signals, and the precision of temperature calibration is usually ± 0.2 K [53].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [53]
A needle-probe device can be used to measure sample thermal properties in situ, but most commonly a temperature-controlled furnace is used to produce the base temperatures for the measurements.
“A needle-probe device can be used to measure sample thermal properties in situ, but most commonly a temperature-controlled furnace is used to produce the base temperatures for the measurements [53].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [53]
The laser flash method has advantages of speed (usually 1-2 s for most solids) and capability to use very small samples (5-12 mm in diameter).
“The advantages of the method are not only its speed (usually 1-2 s for most solid), but also its capability to use very small samples, e.g.5-12 mm in diameter [53].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [53]
Citations
Cites
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
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3 omega method for specific heat and thermal conductivity measurements
Lu, L., Yi, W., & Zhang, D. L. (2002) · arXiv · doi:10.48550/arxiv.quant-ph/0202038 · Cited by 447
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Research works printed but not linked: 22
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Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R. (2016) · Journal of Electronic Packaging · doi:10.1115/1.4034605 · Cited by 559
Yüksel, N. (2016) · Insulation Materials in Context of Sustainability · doi:10.5772/64157 · Cited by 143
Metadata
- Authors
- Tong, X. C.
- Venue
- Springer Series in Advanced Microelectronics
- Publisher
- Springer New York
- Published
- 2010-11-29
- Pages
- 59-129
- ISSN
- 1437-0387
- Cited by
- 14
- References
- 2
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