The DOI matches its Crossref record; 51 of the 51 references it cites were found in a registry or an index.
Terahertz Quality Inspection for Automotive and Aviation Industries
Open accessAbstract
Nondestructive quality inspection with terahertz waves has become an emerging technology, especially in the automotive and aviation industries. Depending on the specific application, different terahertz systems—either fully electronic or based on optical laser pulses—cover the terahertz frequency region from 0.1 THz up to nearly 10 THz and provide high-speed volume inspections on the one hand and high-resolution thickness determination on the other hand. In this paper, we present different industrial applications, which we have addressed with our terahertz systems within the last couple of years. First, we show three-dimensional imaging of glass fiber–reinforced composites and foam structures, and demonstrate thickness determination of multilayer plastic tube walls. Then, we present the characterization of known and unknown multilayer systems down to some microns and the possibility of measuring the thickness of wet paints. The challenges of system reliability in industrial environments, e.g., under the impact of vibrations, and effective solutions are discussed. This paper gives an overview of state-of-the-art terahertz technology for industrial quality inspection. The presented principles are not limited to the automotive and aviation industries but can also be adapted to many other industrial fields.
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“By knowing the refractive indices of the layers under test, the thickness of each layer can be derived from extended analysis of the reflected (or transmitted) terahertz signal even for sub-wavelength thicknesses [2-4].”
From Electronic phase detection with a sub-10 fs timing jitter for terahertz time-domain spectroscopy systems (2023) · cites this paper as [3]
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Cites
Cutting-edge terahertz technology
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The 2023 terahertz science and technology roadmap
Leitenstorfer, A., Moskalenko, A. S., Kampfrath, T., Kono, J., Castro-Camus, E., Peng, K., Qureshi, N., Turchinovich, D., Tanaka, K., Markelz, A. G., et al. (2023) · Journal of Physics D: Applied Physics · doi:10.1088/1361-6463/acbe4c · Cited by 514
From Terahertz Imaging to Terahertz Wireless Communications
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Roadmap of Terahertz Imaging 2021
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Terahertz (THz) biophotonics technology: Instrumentation, techniques, and biomedical applications
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Nsengiyumva, W., Shuncong Zhong, A., Zheng, L., Liang, W., Wang, B., Huang, Y., Chen, X., & Shen, Y. (2023) · IEEE Transactions on Instrumentation and Measurement · doi:10.1109/tim.2023.3318676 · Cited by 142
Metadata
- Authors
- Ellrich, F., Bauer, M., Schreiner, N., Keil, A., Pfeiffer, T., Klier, J., Weber, S., Jonuscheit, J., Friederich, F., & Molter, D.
- Affiliations
- TH Bingen University of Applied Sciences (DE)
- Fraunhofer Institute for Industrial Mathematics (DE)
- University of Kaiserslautern (DE)
- Corresponding author
- Ellrich, F.
- Venue
- Journal of Infrared, Millimeter, and Terahertz Waves
- Published
- 2019-11-26
- Volume
- 41
- Issue
- 4
- Pages
- 470-489
- ISSN
- 1866-6892 (ISSN-L)
- 1866-6906
- OpenAlex
- W2991089963
- Cited by
- 184
- References
- 51
- Citations by year
- 2026: 16 · 2025: 31 · 2024: 22 · 2023: 45 · 2022: 35 · 2021: 23 · 2020: 12
- FWCI
- 6.29
- Type
- journal article
- Language
- en
- Open access
- hybrid
- doi.org
- Locations
- Journal of Infrared Millimeter and Terahertz Waves (publishedVersion, cc-by)
- Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) (submittedVersion, other-oa)
- Fraunhofer-Publica (Fraunhofer-Gesellschaft) (submittedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Terahertz technology and applications
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Physical Sciences › Engineering › Mechanical Engineering › Non-Destructive Testing Techniques
- Keywords
- terahertz imaging, automotive industry, airline industry, glass fiber reinforced composites, foam structure, 3D imaging, thickness measurement, system reliability, vibration resistance
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