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Cited by 3

The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.

Inhibition of the formation of aluminum–copper intermetallic compounds in direct-bonded aluminum–copper ceramic substrates by using a silver metallic interlayer

Yu, Ni-Chi, Lin, Kun-Lin, Lin, Chien-Cheng·2023·Journal of Materials Science
DOI 10.1007/s10853-023-08754-3
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Research works printed but not linked: 22

  1. Schulz-Harder J (2003) Advantages and new development of directly bonded copper substrates. Microelectron Reliab 43:359–365 · DOI · Paper page
  2. Xu L, Wang M, Zhou Y et al (2016) An optimal structural design to improve the reliability of Al2O3–DBC substrates under thermal cycling. Microelectron Reliab 56:101–108 · doi:10.1016/j.microrel.2015.11.013
  3. Dupont L, Khatir Z, Lefebvre S et al (2006) Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectron Reliab 46:1766–1771 · doi:10.1016/j.microrel.2006.07.057
  4. Lei TG, Calata JN, Ngo KD et al (2009) Effects of large-temperature cycling range on direct bond aluminum substrate. IEEE Trans Device Mater Reliab 9:563–568 · doi:10.1109/tdmr.2009.2033668
  5. Lindemann A, Strauch G (2007) Properties of direct aluminum bonded substrates for power semiconductor components. IEEE Trans Power Electron 22:384–391 · DOI
  6. Lu GO (2010) Thermo-Mechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging. Doctoral dissertation, Virginia Tech
  7. Ponweiser N, Lengauer CL, Richter KW (2011) Re-investigation of phase equilibria in the system Al-Cu and structural analysis of the high-temperature phase η1-Al1-δCu. Intermetallics 19:1737–1746 · DOI
  8. Kouters MHM, Gubbels GHM, Ferreira ODS (2013) Characterization of intermetallic compounds in Cu–Al ball bonds: mechanical properties, interface delamination and thermal conductivity. Microelectron Reliab 53:1068–1075 · DOI
  9. Trykov Y, Gurevich L, Pronichev D et al (2014) Influence of strain-hardened zones and intermetallic layers of explosion welded and heat treated Al/Cu laminated metal composites on the evolution of thermal conductivity coefficient. Mater Sci 20:267–270
  10. Feng J, Songbai X (2013) Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn-22Al and Zn-22Al-0.05Ce filler metals. Mater Des 51:907–915 · DOI
  11. GR, Lin KL, Lin CC, (2022) Aging effect on high heat dissipation DBA and DBAC substrates for high power electronics. Ceram Int 48:28889–28897 · DOI
  12. Wei Y, Sun F, Tan S et al (2018) Study on microstructure and performance of transient liquid phase bonding of Cu/Al with Al-based interlayers. Vacuum 154:18–24 · DOI · Paper page
  13. Xiong J, Peng Y, Zhang H et al (2018) Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer. Vacuum 147:187–193 · DOI · Paper page
  14. Lee TH, Lee YJ, Park KT et al (2013) Controlling Al/Cu composite diffusion layer during hydrostatic extrusion by using colloidal Ag. J Mater Process Technol 213:487–494 · DOI
  15. Wang YT, Cheng YH, Lin CC et al (2020) Direct bonding of aluminum to alumina using a nickel interlayer for power electronics applications. Results in Materials 6:100093 · doi:10.1016/j.rinma.2020.100093
  16. Cheng YH, Lin CC, Lin KL (2020) Direct-bonded Al/Al2O3 using a transient eutectic liquid phase. Int J Appl Ceram 17:1652–1660 · doi:10.1111/ijac.13489
  17. Chao WC, Lin CC, Lin KL (2021) Effect of the thickness of nickel film interlayer on direct-bonded aluminum/alumina as substrate in high-power devices. Int J Appl Ceram 18:643–652 · doi:10.1111/ijac.13706
  18. Liu D, Su Y, Guo J et al (2013) Influence of initial solid-liquid interface morphology on further microstructure evolution during directional solidification. Appl Phys A 110:443–451 · doi:10.1007/s00339-012-7234-6
  19. Zarkevich N (2003) Predicted hcp Ag-Al metastable phase diagram, equilibrium ground states, and precipitate structure. Phys Rev B 67:064104 · doi:10.1103/physrevb.67.064104
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  21. Chasserio N, Guillemet-Fritsch S, Lebey T et al (2009) Ceramic substrates for high-temperature electronic integration. J Electron Mater 38:164–174 · doi:10.1007/s11664-008-0571-8
  22. Lee TH, Sim MS, Joo SH et al (2016) Effect of intermetallic compound −thickness on anisotropy of Al/Cu honeycomb rods fabricated by hydrostatic extrusion process. T Nonferr Metal SOC 26:456–463 · DOI

Metadata

Authors
Yu, N.-C., Lin, K.-L., & Lin, C.-C.
Venue
Journal of Materials Science
Publisher
Springer Science and Business Media LLC
Published
2023-07-23
Volume
58
Issue
29
Pages
12072-12082
ISSN
  • 0022-2461
  • 1573-4803
DOI
10.1007/s10853-023-08754-3
Cited by
3
References
1
Language
en
Licence
Funders
National Science Council (MOST 111-2221-E-492-014-MY2, MOST 111-2119-M-002-020-MBK)

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CoChat. (2026). Citation check: Inhibition of the formation of aluminum–copper intermetallic compounds in direct-bonded aluminum–copper ceramic substrates by using a silver metallic interlayer. https://app.cochat.ai/papers/10.1007/s10853-023-08754-3
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Yu, N.-C., Lin, K.-L., & Lin, C.-C. (2023). Inhibition of the formation of aluminum–copper intermetallic compounds in direct-bonded aluminum–copper ceramic substrates by using a silver metallic interlayer. Journal of Materials Science. https://doi.org/10.1007/s10853-023-08754-3

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.