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Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer

Xiong, Jiangtao, Peng, Yu, Zhang, Hao, Li, Jinglong, Zhang, Fusheng·2018·Vacuum
DOI 10.1016/j.vacuum.2017.10.033
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Research works printed but not linked: 31

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Metadata

Authors
Xiong, J., Peng, Y., Zhang, H., Li, J., & Zhang, F.
Venue
Vacuum
Publisher
Elsevier BV
Published
2018-01
Volume
147
Pages
187-193
ISSN
0042-207X
DOI
10.1016/j.vacuum.2017.10.033
Cited by
51
References
0
Language
en
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Funders
  • State Key Laboratory of Solidification Processing (NWPU), China (141-TZ-2016)
  • National Natural Science Foundation of China (51575451, 51475376)

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CoChat. (2026). Citation check: Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer. https://app.cochat.ai/papers/10.1016/j.vacuum.2017.10.033
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Xiong, J., Peng, Y., Zhang, H., Li, J., & Zhang, F. (2018). Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer. Vacuum. https://doi.org/10.1016/j.vacuum.2017.10.033