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Study on microstructure and performance of transient liquid phase bonding of Cu/Al with Al-based interlayers

Wei, Yanni, Sun, Fu, Tan, Shiyou, Liang, Shuhua·2018·Vacuum

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Cited by 32

Research works printed but not linked: 24

  1. Xue, 2011, Effect of friction stir welding parameters on the microstructure and mechanical properties of the dissimilar Al–Cu joints, Mater. Sci. Eng., A, 528, 4683, 10.1016/j.msea.2011.02.067 · DOI
  2. Solchenbach, 2013, Mechanical characteristics of laser braze-welded aluminium–copper connections, Optic Laser. Technol., 54, 249, 10.1016/j.optlastec.2013.06.003 · DOI
  3. Wei, 2017, Microstructure evolution and failure analysis of an aluminum–copper cathode conductive head produced by explosive welding, J. Mater. Eng. Perform., 26, 1, 10.1007/s11665-017-3055-2 · DOI
  4. Mehta, 2016, A review on dissimilar friction stir welding of copper to aluminum: process, properties and variants, Mater. Manuf. Process., 31, 233, 10.1080/10426914.2015.1025971 · DOI
  5. Xia, 2008, Microstructure and phase constitution near the interface of Cu/Al vacuum brazing using Al–Si filler metal, Vacuum, 82, 799, 10.1016/j.vacuum.2007.11.007 · DOI
  6. Lee, 2005, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during an-nealing, J. Alloy. Comp., 390, 212, 10.1016/j.jallcom.2004.07.057 · DOI · Paper page
  7. Xiong, 2018, Microstructure and mechanical properties of Al-Cu joints diffusion bonded with Ni or Ag interlayer, Vacuum, 147, 187, 10.1016/j.vacuum.2017.10.033 · DOI · Paper page
  8. Chen, 2017, Microstructure and mechanical property of aluminum/copper dissimilar friction welded joints, Weld. J., 96, 63
  9. Xue, 2010, Enhanced mechanical properties of friction stir welded dissimilar Al–Cu joint by intermetallic compounds, Mater. Sci. Eng., A, 527, 5723, 10.1016/j.msea.2010.05.061 · DOI
  10. Wei, 2016, Investigation of interdiffusion and intermetallic compounds in Al-Cu joint produced by continuous drive friction welding, Eng. Sci. Technol. Inter. J., 19, 90
  11. Abbasi, 2001, Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process, J. Alloy. Comp., 319, 233, 10.1016/S0925-8388(01)00872-6 · DOI · Paper page
  12. Xiao, 2013, Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal, Mater. Des., 52, 740, 10.1016/j.matdes.2013.06.016 · DOI
  13. Hoseini Athar, 2015, Weldability window and the effect of interface morphology on the properties of Al/Cu/Al laminated composites fabricated by explosive welding, Mater. Des., 86, 516, 10.1016/j.matdes.2015.07.114 · DOI
  14. Sheng, 2011, Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling, Comp. Part. B., 42, 1468, 10.1016/j.compositesb.2011.04.045 · DOI · Paper page
  15. Hoseini-Athar, 2016, Interface morphology and mechanical properties of Al-Cu-Al laminated composites fabricated by explosive welding and subsequent rolling process, Met. Mater. Int., 22, 670, 10.1007/s12540-016-5687-4 · DOI
  16. Braunovic, 1994, Intermetallic compounds at aluminum-to-copper electrical interfaces: effect of temperature and electric current, Compon. Packag. Manuf. Technol. Part A IEEE Trans., 17, 78, 10.1109/95.296372 · DOI · Paper page
  17. Chen, 2014, Interface development in Cu-Based structures transient liquid phase (TLP) bonded with thin Al foil intermediate layers, Metall. Mater. Trans., 45, 3892, 10.1007/s11661-014-2339-5 · DOI
  18. Dehkordi, 2016, Effect of time and temperature on TLP bonding of alumina using a bismuth oxide interlayer, Ceram. Int., 42, 1705, 10.1016/j.ceramint.2015.09.127 · DOI
  19. Guo, 2010, Intermetallic phase formation in diffusion–bonded Cu/Al laminates, J. Mater. Sci., 46, 2467, 10.1007/s10853-010-5093-0 · DOI
  20. Hannech, 2003, Intermetallic formation in the aluminum–copper system, Surf. Rev. Lett., 10, 677, 10.1142/S0218625X03005396 · DOI
  21. Tanaka, 2007, Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu–Al system, Mater. Sci. Eng., A, 459, 101, 10.1016/j.msea.2006.12.092 · DOI
  22. Zhang, 2010, Reactive brazing of aluminium to aluminium-based composite reinforced with alumina borate whiskers with Cu interlayer, Vacuum, 84, 474, 10.1016/j.vacuum.2009.10.010 · DOI
  23. Xiao, 2013, Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal, Mater. Des., 52, 740, 10.1016/j.matdes.2013.06.016 · DOI
  24. Lumley, 1999, Surface oxide and the role of magnesium during the sintering of aluminum, Metall. Mater. Trans., 30, 457, 10.1007/s11661-999-0335-y · DOI

Metadata

Authors
Wei, Y., Sun, F., Tan, S., & Liang, S.
Venue
Vacuum
Publisher
Elsevier BV
Published
2018-08
Volume
154
Pages
18-24
ISSN
0042-207X
Cited by
32
Language
en
Funders
  • Doctoral Scientific Research Start-up Foundation from Henan University of Technology (101-451115015)
  • Key Research and Development Project of Hainan Province (2017ZDXM-GY-033)
  • National Natural Science Foundation of China (51701154)
  • Scientific Research Plan Projects of Shaanxi Education Department (17JK0563)

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CoChat. (2026). Citation check: Study on microstructure and performance of transient liquid phase bonding of Cu/Al with Al-based interlayers. https://app.cochat.ai/papers/10.1016/j.vacuum.2018.04.036
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Wei, Y., Sun, F., Tan, S., & Liang, S. (2018). Study on microstructure and performance of transient liquid phase bonding of Cu/Al with Al-based interlayers. Vacuum. https://doi.org/10.1016/j.vacuum.2018.04.036