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Characterization of Steel-Ta Dissimilar Metal Builds Made Using Very High Power Ultrasonic Additive Manufacturing (VHP-UAM)
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The softer foil can be severely deformed to have a large area of intimate contact with the harder foil and to occupy the surface micro-valleys of the harder foil.
“It has been demonstrated [7,17] that the softer foil can be severely deformed to have a large area of intimate contact with the harder foil and to occupy the surface micro-valleys of the harder foil.”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [17]
The cause of the variation of hardness profile on the aluminum part from the interface to the interior may be a work-hardening process.
“According to the investigation by Sridharan et al. [15,17] on steel-Ta and Al-Ti, the cause of the variation of hardness profile on the aluminum part (from the interface to the interior) may be a work-hardening process.”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [17]
The hardness values obtained from the nanoindentation hardness map range between the hardness of Cu110 and Al6061 foils, which is close to the values of hardness reported in the literature for the interface zone subjected to strain hardening.
“The hardness values obtained from the nanoindentation hardness map range between the hardness of Cu110 and Al6061 foils, which is close to the values of hardness reported in the literature [8,15,17] for the interface zone subjected to strain hardening.”
From Multi-layer solid-state ultrasonic additive manufacturing of aluminum/copper: local properties and texture (2024) · cites this paper as [17]
Previous UAM work has shown that similar metals, and dissimilar metals undergo intense plastic deformation at the interface to induce bond formation.
“Previous UAM work has shown that similar metals [8,33] , and dissimilar metals undergo intense plastic deformation at the interface to induce bond formation [15,34,35] .”
From Interdiffusion of Elements During Ultrasonic Additive Manufacturing (2021) · cites this paper as [34]
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Research works printed but not linked: 36
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Cited by
Sorted by citations
Interdiffusion of Elements During Ultrasonic Additive Manufacturing
Pagan, M., Petrie, C., Leonard, D., Sridharan, N., Zinkle, S., & Babu, S. S. (2021) · Metallurgical and Materials Transactions A · doi:10.1007/s11661-020-06131-2 · Cited by 23
Self-citationBehvar, A., Shakil, S. I., Pirgazi, H., Norfolk, M., & Haghshenas, M. (2024) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-024-13490-2 · Cited by 18
“It has been demonstrated [7, 17] that the softer foil can be severely deformed to have a large area of intimate contact with the harder foil and to occupy the surface micro-valleys of the harder foil.”
InfluentialSelf-citation
Metadata
- Authors
- Sridharan, N., Norfolk, M., & Babu, S. S.
- Affiliations
- The Ohio State University (US)
- Corresponding author
- Sridharan, Niyanth
- Babu, Sudarsanam Suresh
- Venue
- Metallurgical and Materials Transactions A
- Published
- 2016-02-24
- Volume
- 47
- Issue
- 5
- Pages
- 2517-2528
- ISSN
- 1073-5623 (ISSN-L)
- 1543-1940
- OpenAlex
- W2277165861
- Cited by
- 41
- References
- 0
- Citations by year
- 2026: 4 · 2025: 3 · 2024: 3 · 2023: 2 · 2022: 8 · 2021: 5 · 2020: 5 · 2019: 4 · 2018: 4 · 2017: 2 · 2016: 1
- FWCI
- 3.26
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- Metallurgical and Materials Transactions A (publishedVersion)
- Funders
- Ohio State University
- Egg Farmers of Canada
- Oak Ridge National Laboratory
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Additive Manufacturing Materials and Processes
- Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
- Keywords
- ultrasonic additive manufacturing, dissimilar metal joining, microstructure evolution, grain refinement, dynamic recrystallization, adiabatic heating, interfacial bonding, solid-state bonding, electron backscatter diffraction, nanoindentation
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