The DOI matches its Crossref record; 19 of the 19 references it cites were found in a registry or an index.
Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“Some pin fins were experimentally and numerically investigated by Yang et al. [125] for microchannel heat sinks including five pin shapes: triangle, square, pentagon, hexagon, and circle. The circular pins showed the least pressure drop while triangular ones showed the highest flow blocking.”
From Compact and microchannel heat exchangers: A comprehensive review of air-side friction factor and heat transfer correlations (2018) · cites this paper as [125]
Citations
Cites
High-performance heat sinking for VLSI
Tuckerman, D. B., & Pease, R. F. W. (1981) · IEEE Electron Device Letters · doi:10.1109/edl.1981.25367 · Cited by 5,291
Single-phase convective heat transfer in microchannels: a review of experimental results
Morini, G. L. (2004) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2004.01.003 · Cited by 679
Cooling performance of a microchannel heat sink with nanofluids
Jang, S. P., & Choi, S. U. S. (2006) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2006.02.036 · Cited by 462
Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance
Chein, R., & Chen, J. (2009) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2008.12.019 · Cited by 255
Optimization of short micro pin fins in minichannels
Tullius, J. F., Tullius, T. K., & Bayazıtoğlu, Y. (2012) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2012.03.022 · Cited by 245
Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls
Gong, L., Kota, K. M., Tao, W., & Joshi, Y. K. (2011) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4003284 · Cited by 203
Abdoli, A., Jimenez, G., & Dulikravich, G. S. (2015) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2014.12.021 · Cited by 178
A Review of Cooling in Microchannels
Tullius, J. F., Vajtai, R., & Bayazıtoğlu, Y. (2010) · Heat Transfer Engineering · doi:10.1080/01457632.2010.506390 · Cited by 167
Seyf, H. R., Zhou, Z., Ma, H., et al. (2012) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2012.08.052 · Cited by 162
Seyf, H. R., & Feizbakhshi, M. (2012) · International Journal of Thermal Sciences · doi:10.1016/j.ijthermalsci.2012.02.018 · Cited by 149
Cited by
Qasem, N. A. A., & Zubair, S. M. (2018) · Energy Conversion and Management · doi:10.1016/j.enconman.2018.06.104 · Cited by 134
Experimental study of heat transfer performance of a tube with different shaped pin fins
Huang, L., Li, Q., & Zhai, H. (2018) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2017.10.014 · Cited by 33
Metadata
- Authors
- Yang, D., Wang, Y., Ding, G., Jin, Z., Zhao, J., & Wang, G.
- Affiliations
- Shanghai Jiao Tong University (CN)
- Corresponding author
- Wang, Yan
- Venue
- Applied Thermal Engineering
- Publisher
- Elsevier BV
- Published
- 2017-02
- Volume
- 112
- Pages
- 1547-1556
- ISSN
- 1359-4311 (ISSN-L)
- OpenAlex
- W2511432550
- Cited by
- 235
- References
- 19
- Citations by year
- 2026: 28 · 2025: 38 · 2024: 39 · 2023: 32 · 2022: 22 · 2021: 22 · 2020: 18 · 2019: 17 · 2018: 13 · 2017: 6
- FWCI
- 10.67
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- Locations
- Applied Thermal Engineering (publishedVersion)
- Funders
- National Natural Science Foundation of China (51305265)
- Major State Basic Research Development Program of China (613204)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Optimization
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer Mechanisms
- Keywords
- microchannel heat sinks, heat transfer enhancement, pressure drop, thermal resistance, single-phase cooling, deionized water coolant, staggered pin fins
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations. https://app.cochat.ai/papers/10.1016/j.applthermaleng.2016.08.211
- The paper
- Yang, D., Wang, Y., Ding, G., Jin, Z., Zhao, J., & Wang, G. (2017). Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations. Applied Thermal Engineering. https://doi.org/10.1016/j.applthermaleng.2016.08.211
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.