The DOI matches its Crossref record; 107 of the 108 references it cites were found in a registry or an index.
Mechanism of ultrasonic effects on thermal-stress field in Cu/Al-FSW process
Overview
Integrity signals
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Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
In the citing paper
“The reason is that the increasing welding speed and application of ultrasonic vibration could both reduce the heat generation and the temperature in the nugget zone [36], which could further inhibit the generation of IMCs.”
From Effect of Ultrasound on Microstructure and Properties of Aluminum–Copper Friction Stir Lap Welding (2024) · cites this paper as [36]
In the citing paper
“This indicated that the application of ultrasound cannot change the generation order of Al/Cu-IMCs, which was consistent with Huang et al. [39] and our previous research on aluminum-copper FSW [36].”
From Effect of Ultrasound on Microstructure and Properties of Aluminum–Copper Friction Stir Lap Welding (2024) · cites this paper as [36]
Citations
Cites
Xue, P., Ni, D. R., Wang, D., Xiao, B., & Ma, Z. Y. (2011) · Materials Science and Engineering A · doi:10.1016/j.msea.2011.02.067 · Cited by 404
Sadeghian, A., & Iqbal, N. (2022) · Optics & Laser Technology · doi:10.1016/j.optlastec.2021.107595 · Cited by 286
Saeid, T., Abdollah-zadeh, A., & Sazgari, B. (2010) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2009.10.127 · Cited by 268
Tan, C. W., Jiang, Z. G., Li, L. Q., Chen, Y. B., & Chen, X. Y. (2013) · Materials & Design · doi:10.1016/j.matdes.2013.04.056 · Cited by 265
Hang, C. J., Wang, C., Mayer, M., Tian, Y., Zhou, Y., & Wang, H. H. (2007) · Microelectronics Reliability · doi:10.1016/j.microrel.2007.06.008 · Cited by 253
Chen, G., Li, H., Wang, G., Guo, Z., Zhang, S., Dai, Q., Wang, X., Zhang, G., & Shi, Q. (2017) · International Journal of Machine Tools and Manufacture · doi:10.1016/j.ijmachtools.2017.09.002 · Cited by 222
Daud, Y., Lucas, M., & Huang, Z. (2006) · Journal of Materials Processing Technology · doi:10.1016/j.jmatprotec.2006.12.032 · Cited by 215
Temperature and stress distribution in ultrasonic metal welding—An FEA-based study
Elangovan, S., Semeer, S., & Prakasan, K. (2009) · Journal of Materials Processing Technology · doi:10.1016/j.jmatprotec.2008.03.032 · Cited by 191
Liu, X., Wu, C., & Padhy, G. K. (2015) · Scripta Materialia · doi:10.1016/j.scriptamat.2015.02.022 · Cited by 184
Sahu, P. K., Pal, S., Pal, S. K., & Jain, R. (2016) · Journal of Materials Processing Technology · doi:10.1016/j.jmatprotec.2016.04.014 · Cited by 169
Cited by
Habba, M. I. A., & Ahmed, M. M. Z. (2025) · Journal of Advanced Joining Processes · doi:10.1016/j.jajp.2025.100293 · Cited by 39
Xiong, Y., Su, Y., Yang, X., Xu, Y., Li, W., Xu, W., & Çam, G. (2025) · The International Journal of Advanced Manufacturing Technology · doi:10.1007/s00170-025-16304-1 · Cited by 37
Microstructure-based simulation of constitutive behaviors in friction stir additive manufacturing
Li, J. Y., Wang, B., Lindgren, L., & Zhang, Z. (2024) · International Journal of Mechanical Sciences · doi:10.1016/j.ijmecsci.2024.109863 · Cited by 20
Wu, C., Gao, S., Yin, Q., Shi, L., Yang, C., Kumar, S., Zhao, W., Zhang, H., & Guo, N. (2025) · Materials Characterization · doi:10.1016/j.matchar.2025.115405 · Cited by 19
Self-citationZhang, J. B., Liu, Q., & Huang, Y. (2024) · Materials Characterization · doi:10.1016/j.matchar.2024.114456 · Cited by 16
Metadata
- Authors
- Zhao, W., Zhu, Y., Liu, Z., Fu, A., & He, H.
- Affiliations
- Yantai University (CN)
- Central South University (CN)
- Corresponding author
- Fu, Ao
- He, Huan
- Venue
- International Journal of Mechanical Sciences
- Publisher
- Elsevier BV
- Published
- 2024-05
- Volume
- 270
- Pages
- 109101
- ISSN
- 0020-7403 (ISSN-L)
- OpenAlex
- W4391738924
- Cited by
- 35
- References
- 108
- Citations by year
- 2026: 7 · 2025: 24 · 2024: 4
- FWCI
- 4.70
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- www.elsevier.com/legal/tdmrep-license (tdm)
- doi.org/10.15223/policy-017 (stm-asf)
- doi.org/10.15223/policy-037 (stm-asf)
- doi.org/10.15223/policy-012 (stm-asf)
- doi.org/10.15223/policy-029 (stm-asf)
- doi.org/10.15223/policy-004 (stm-asf)
- Locations
- International Journal of Mechanical Sciences (publishedVersion)
- Funders
- National Natural Science Foundation of China (52205423)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Keywords
- friction stir welding, ultrasonic vibration, intermetallic compounds, thermal stress field, acoustic softening, interfacial heat flux, interdiffusion, Al2Cu, Al4Cu9, mechanical interlocking, tensile strength
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
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Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
