The DOI matches its Crossref record; 29 of the 29 references it cites were found in a registry or an index.
Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface
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Citations
Cites
Munir, Z. A., Anselmi-Tamburini, U., & Ohyanagi, M. (2006) · Journal of Materials Science · doi:10.1007/s10853-006-6555-2 · Cited by 2,257
Ho, P. S., & Kwok, T. (1989) · Reports on Progress in Physics · doi:10.1088/0034-4885/52/3/002 · Cited by 836
Enhanced growth of intermetallic phases in the Ni–Ti system by current effects
Garay, J. E., Anselmi‐Tamburini, U., & Munir, Z. A. (2003) · Acta Materialia · doi:10.1016/s1359-6454(03)00284-2 · Cited by 345
Fundamental investigations on the spark plasma sintering/synthesis process
Anselmi‐Tamburini, U., Garay, J. E., & Munir, Z. A. (2005) · Materials Science and Engineering A · doi:10.1016/j.msea.2005.06.066 · Cited by 237
Electric current enhanced defect mobility in Ni3Ti intermetallics
Garay, J. E., Glade, S. C., Anselmi‐Tamburini, U., Asoka‐Kumar, P., & Munir, Z. A. (2004) · Applied Physics Letters · doi:10.1063/1.1774268 · Cited by 215
Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions
Chen, S.-W., Chen, C., & Liu, W.-C. (1998) · Journal of Electronic Materials · doi:10.1007/s11664-998-0068-5 · Cited by 206
Electrical Resistivity of Aluminum and Manganese
Desai, P. D., James, H. M., & Ho, C. Y. (1984) · Journal of Physical and Chemical Reference Data · doi:10.1063/1.555725 · Cited by 199
Electromigration in Sn–Pb solder strips as a function of alloy composition
Liu, C. Y., Chen, C., & Tu, K. N. (2000) · Journal of Applied Physics · doi:10.1063/1.1319327 · Cited by 157
Enhanced atomic diffusion of Fe–Al diffusion couple during spark plasma sintering
Li, R., Yuan, T., Liu, X., & Zhou, K. (2015) · Scripta Materialia · doi:10.1016/j.scriptamat.2015.08.012 · Cited by 123
Electromigration effects in Al-Au multilayers
Bertolino, N., Garay, J. E., Anselmi‐Tamburini, U., & Munir, Z. A. (2001) · Scripta Materialia · doi:10.1016/s1359-6462(00)00669-2 · Cited by 117
Metadata
- Authors
- Shao, J., Deng, S., Zhao, H., Lou, L., Shi, B., Chen, L., & Xu, L.
- Venue
- Intermetallics
- Publisher
- Elsevier BV
- Published
- 2024-01
- Volume
- 164
- Pages
- 108110
- ISSN
- 0966-9795
- Cited by
- 13
- References
- 29
- Language
- en
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- www.elsevier.com/legal/tdmrep-license (tdm)
- doi.org/10.15223/policy-017 (stm-asf)
- doi.org/10.15223/policy-037 (stm-asf)
- doi.org/10.15223/policy-012 (stm-asf)
- doi.org/10.15223/policy-029 (stm-asf)
- doi.org/10.15223/policy-004 (stm-asf)
- Funders
- National Natural Science Foundation of China (52264053)
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- CoChat. (2026). Citation check: Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface. https://app.cochat.ai/papers/10.1016/j.intermet.2023.108110
- The paper
- Shao, J., Deng, S., Zhao, H., Lou, L., Shi, B., Chen, L., & Xu, L. (2024). Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface. Intermetallics. https://doi.org/10.1016/j.intermet.2023.108110
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
