The DOI matches its Crossref record; 6 of the 6 references it cites were found in a registry or an index.
Electromigration in metals
Abstract
This paper provides an overview on the current understanding of electromigration in metals. The discussion is first focused on studies in bulk metals and alloys. This part includes a thermodynamic formulation of electromigration, a kinetic analysis of the atomic processes and a review of the theory. In addition, experimental results in interstitial and substitutional systems are summarised. The second part of the paper reviews the studies in metallic thin films. This emerged as an important area of electromigration studies since the late 1960s when electromigration damage was found to cause failure of conductor lines in integrated circuits. The discussion will review first the basic nature of electromigration in thin films with emphasis on the role of grain boundaries in mass transport and damage formation. Then the materials issues of electromigration will be explored according to the scaling trends in VLSI technology. Finally, the recent results of electromigration in fine lines and device contacts of dimensions in the micrometre range are discussed.
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Citations
Cites
Hansen, M., Anderko, K., & Salzberg, H. W. (1958) · Journal of The Electrochemical Society · doi:10.1149/1.2428700 · Cited by 14,782
Design of ion-implanted MOSFET's with very small physical dimensions
Dennard, R. H., Gaensslen, F. H., Yu, H.-N., Rideout, V. L., Bassous, E., & LeBlanc, A. R. (1974) · IEEE Journal of Solid-State Circuits · doi:10.1109/jssc.1974.1050511 · Cited by 3,548
Electromigration—A brief survey and some recent results
Black, J. R. (1969) · IEEE Transactions on Electron Devices · doi:10.1109/t-ed.1969.16754 · Cited by 1,506
Diffusion Kinetics for Atoms in Crystals
Manning, J. R., & Bruner, L. J. (1968) · American Journal of Physics · doi:10.1119/1.1974325 · Cited by 1,100
Diffusion in Solids: Recent Developments
Nowick, A. S., & Burton, J. J. (1975) · Cited by 1,002
Quantum Theory of Diffusion with Application to Light Interstitials in Metals
Flynn, C. P., & Stoneham, A. M. (1970) · Physical Review B · doi:10.1103/physrevb.1.3966 · Cited by 671
Cited by
Tran, T. S., Dutta, N. K., & Choudhury, N. R. (2018) · Advances in Colloid and Interface Science · doi:10.1016/j.cis.2018.09.003 · Cited by 298
Palumbo, F., Wen, C., Lombardo, S., Pazos, S., Aguirre, F., Eizenberg, M., Hui, F., & Lanza, M. (2020) · Advanced Functional Materials · doi:10.1002/adfm.201900657 · Cited by 268
Braunovic, M., & Alexandrov, N. (1994) · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · doi:10.1109/95.296372 · Cited by 169
Momentum of superconducting electrons and the explanation of the Meissner effect
Hirsch, J. E. (2017) · Physical Review B · doi:10.1103/physrevb.95.014503 · Cited by 53
Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface
Shao, J., Deng, S., Zhao, H., Lou, L., Shi, B., Chen, L., & Xu, L. (2024) · Intermetallics · doi:10.1016/j.intermet.2023.108110 · Cited by 13
Metadata
- Authors
- Ho, P. S., & Kwok, T.
- Venue
- Reports on Progress in Physics
- Publisher
- IOP Publishing
- Published
- 1989-03-01
- Volume
- 52
- Issue
- 3
- Pages
- 301-348
- ISSN
- 0034-4885 (ISSN-L)
- 1361-6633
- OpenAlex
- W1997326261
- Cited by
- 836
- References
- 6
- FWCI
- 5.94
- Type
- journal article
- Language
- en
- Open access
- closed
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Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
