The DOI matches its Crossref record; 36 of the 36 references it cites were found in a registry or an index.
Microstructure evolution and mechanical properties of friction stir spot welded dissimilar aluminum-copper joint
Abstract
Abstract Dissimilar lap joints of 1060 aluminum and T2 copper were obtained by friction stir spot welding (FSSW) at various rotational speeds. The measured process variables during welding revealed that an increasing rotational speed leads to a higher peak temperature but a lower torque and plunging force due to the greater softening degree of material. A continuous CuAl2-CuAl-Al4Cu9 laminated layer developed at the Al-Cu interface under the highest rotational speed, while the interface was characterized by the interruptedly distributed CuAl2 layer under lower rotational speeds. Intermetallic compound (IMC) formation sequence for CuAl2, CuAl and Al4Cu9 was predicted according to thermodynamic principles, which is consistent with the interfacial microstructure evolution identified by the transmission electron microscope (TEM). Besides the metallurgical bonding through the IMC layer at the Al-Cu interface, joints have a Cu hook extruded upward by the pin tool from the lower Cu sheet into the upper Al sheet, which provided additional mechanical interlocking between the sheets. Tensile properties of the joints were closely related to the thickness of the IMC layer and geometric features of the hook, higher tensile properties were found in joints owning a continuous interfacial IMC layer with a proper thickness as well as a high penetration depth of the hook into the upper Al sheet.
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In the citing paper
“The growth of IMCs is influenced by heat input during the joining process and joint cooling rate, which can be suppressed by using a low heat input process, such as ultrasonic welding [11], friction stir welding [12], and friction stir double-riveting welding [13]”
From Effect of nickel interlayer thickness on intermetallic compound formation and interfacial integrity in pulsed laser welding of aluminum and copper (2026) · cites this paper as [12]
In the citing paper
“EDS analysis at point 1 shows Cu content below 25 at%, indicating an Al-Cu eutectic alloy [12]”
From Effect of nickel interlayer thickness on intermetallic compound formation and interfacial integrity in pulsed laser welding of aluminum and copper (2026) · cites this paper as [12]
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Metadata
- Authors
- Zhou, L., Li, G. H., Zhang, R. X., Zhou, W. L., He, W. X., Huang, Y. X., & Song, X. G.
- Affiliations
- Harbin Institute of Technology (CN)
- Corresponding author
- Zhou, L.
- Huang, Y.X.
- Venue
- Journal of Alloys and Compounds
- Publisher
- Elsevier BV
- Published
- 2019-02
- Volume
- 775
- Pages
- 372-382
- ISSN
- 0925-8388 (ISSN-L)
- OpenAlex
- W2897614595
- Cited by
- 144
- References
- 36
- Citations by year
- 2026: 11 · 2025: 17 · 2024: 20 · 2023: 22 · 2022: 24 · 2021: 17 · 2020: 19 · 2019: 14
- FWCI
- 7.99
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- Locations
- Journal of Alloys and Compounds (publishedVersion)
- Funders
- National Natural Science Foundation of China (51205084)
- Natural Science Foundation of Shandong Province (ZR2016EEM43)
- Topics
- Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
- Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
- Physical Sciences › Materials Science › Metals and Alloys › Metallurgy and Material Science
- Keywords
- friction stir spot welding, dissimilar metal joining, aluminum-copper joints, 1060 aluminum, T2 copper, rotational speed, intermetallic compound formation, CuAl2, CuAl, Al4Cu9, interfacial microstructure, metallurgical bonding, mechanical interlocking, tensile properties, peak temperature
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
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Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.