Study on diffusion characteristics of Al-Cu systems and mechanical properties of intermetallics

An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

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Measurement of hardness and elastic modulus by instrumented indentation: Advances in understanding and refinements to methodology

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Growth kinetics of planar binary diffusion couples: ’’Thin-film case’’ versus ’’bulk cases’’

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Multiphase diffusion in binary and ternary solid-state systems

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Coupled phase diagrams and thermochemical data for transition metal binary systems-VI

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Mechanical properties of nanophase TiO 2 as determined by nanoindentation

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Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

Lee, W.-B., Bang, K.-S., & Jung, S.-B. (2005) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2004.07.057 · Cited by 368

Indentation of a power law creeping solid

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Investigation of creep behaviour under load during indentation experiments and its influence on hardness and modulus results

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A critical appraisal of the extraction of creep parameters from nanoindentation data obtained at room temperature

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Nanoindentation in materials research: Past, present, and future

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Coupled phase diagrams and thermochemical data for transition metal binary systems — V

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The relationship between indentation and uniaxial creep in amorphous selenium

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Correcting power-law viscoelastic effects in elastic modulus measurement using depth-sensing indentation

Ngan, A. H. W., Wang, H., Tang, B. H., & Sze, K. Y. (2004) · International Journal of Solids and Structures · doi:10.1016/j.ijsolstr.2004.07.018 · Cited by 173

The Ag–Al–Cu systemPart I: Reassessment of the constituent binaries on the basis of new experimental data

Witusiewicz, V. T., Hecht, U., Fries, S. G., et al. (2004) · Journal of Alloys and Compounds · doi:10.1016/s0925-8388(04)00676-0 · Cited by 148

Re-investigation of phase equilibria in the system Al–Cu and structural analysis of the high-temperature phase η1-Al1−δCu

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CuAl2 revisited: Composition, crystal structure, chemical bonding, compressibility and Raman spectroscopy

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Bimetallic copper–aluminium tube by severe plastic deformation

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Diffusion kinetics, mechanical properties, and crystallographic characterization of intermetallic compounds in the Mg–Zn binary system

Kammerer, C. C., Behdad, S., Zhou, L., Betancor, F., Gonzalez, M., Boesl, B., & Sohn, Y. (2015) · Intermetallics · doi:10.1016/j.intermet.2015.08.001 · Cited by 77

Crystal perfection in a noncentrosymmetric alloy. Refinement and test of twinning of the γ-Cu9Al4structure

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Evolution of bonding interface in solid–liquid cast-rolling bonding of Cu/Al clad strip

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Thermodynamic assessment of the Al–Cu–Zn system, part I: Cu–Zn binary system

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Calculation of phase diagrams and solidification paths of Al-rich Al−Li−Cu alloys

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Thermodynamic assessment of the Al–Cu–Zn system, part II: Al–Cu binary system

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Diffusivity of Ni in an amorphous Ni-Zr alloy

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Diffusional behaviors and mechanical properties of Cu–Zn system

Liu, K., Ding, W., Tao, X., Chen, H., Ouyang, Y., & Du, Y. (2019) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2019.152141 · Cited by 45

Continuous Strain Bursts in Crystalline and Amorphous Metals During Plastic Deformation by Nanoindentation

Li, H., Ngan, A. H. W., & Wang, M. G. (2005) · Journal of materials research/Pratt's guide to venture capital sources · doi:10.1557/jmr.2005.0379 · Cited by 40

Cu-Al interfacial formation and kinetic growth behavior during HTS reliability test

Liu, C.-P., Chang, S.-J., Liu, Y.-F., & Chen, W.-S. (2019) · Journal of Materials Processing Technology · doi:10.1016/j.jmatprotec.2018.12.012 · Cited by 38

Investigation of diffusion behavior and mechanical properties of Mg-Zn system

Ouyang, Y., Liu, K., Peng, C., Chen, H., Tao, X., & Du, Y. (2019) · Calphad · doi:10.1016/j.calphad.2019.03.003 · Cited by 35

Numerical analysis for migration of interface between liquid and solid phases during reactive diffusion in the binary Cu–Al system

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Rate-dependent indentation hardness of a power-law creep solder alloy

Ma, X., & YOSHIDA, F. (2003) · Applied Physics Letters · doi:10.1063/1.1537513 · Cited by 33

The Crystal Structure of ζ2‐Al3Cu4‐δ

Gulay, L. D., & Harbrecht, B. (2003) · Zeitschrift für anorganische und allgemeine Chemie · doi:10.1002/zaac.200390076 · Cited by 33

Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy

Moisy, F., Sauvage, X., & Hug, É. (2020) · Materialia · doi:10.1016/j.mtla.2020.100633 · Cited by 26

Microstructural and Nanoindentation Studies Across Diffusion-bonded Interfaces in Al/Cu Metal Intermetallic Laminates

Sonti, K. S. M., Vamsi, K. V., Ravisankar, B., Sivaprasad, K., & Karthikeyan, S. (2014) · Procedia Materials Science · doi:10.1016/j.mspro.2014.07.087 · Cited by 17

Optimisation of interface formation by shear inclination: Example of aluminium-copper hybrid produced by ECAP with back-pressure

Medvedev, A. E., Lapovok, R., Koch, E., Höppel, H. W., & Göken, M. (2018) · Materials & Design · doi:10.1016/j.matdes.2018.03.021 · Cited by 14

The Ag?Al?Cu System. Part 1. Reassessment of the Constituent Binaries on the Basis of New Experimental Data.

Witusiewicz, V. T., Hecht, U., Fries, S. G., & Rex, S. (2005) · ChemInform · doi:10.1002/chin.200511020 · Cited by 3

Improved mechanical and electrical properties of copper-aluminum joints with highly aligned graphene reinforcement via friction stir spot welding

Mohd Isa, M. S., Muhamad, M. R., Yusof, F., Yusoff, N., Brytan, Z., Suga, T., Morisada, Y., & Fujii, H. (2023) · Journal of Materials Research and Technology · doi:10.1016/j.jmrt.2023.05.155 · Cited by 22

Microstructural and mechanical characterization of Al/Cu interface in a bimetallic composite produced by compound casting

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