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Cited by 73Advanced Welding Techniques AnalysisMicrostructure and mechanical propertiesElectronic Packaging and Soldering Technologies

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Effects of annealing temperature on the interfacial microstructure and bonding strength of Cu/Al clad sheets produced by twin-roll casting and rolling

Mao, Zhiping, Xie, Jingpei, Wang, Aiqin, Wang, Wenyan, Ma, Douqin, Liu, Pei·2020·Journal of Materials Processing Technology
DOI 10.1016/j.jmatprotec.2020.116804
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Research works printed but not linked: 24

  1. Bae, 2011, Cladding of Mg alloy with Al by twin-roll casting, Scripta Mater., 64, 836, 10.1016/j.scriptamat.2011.01.013 · DOI
  2. Baker, 1987, In-situ straining of Ni3Al in a transmission electron microscope, Acta Metall., 35, 1533, 10.1016/0001-6160(87)90098-8 · DOI
  3. Barekar, 2014, Twin-roll casting of aluminum alloys – an overview, Mater. Manuf. Processes, 29, 651, 10.1080/10426914.2014.912307 · DOI
  4. Chen, 2006, Influence of interfacial structure development on the fracture mechanism and bond strength of aluminum/copper bimetal plate, Mater. Trans., 47, 1232, 10.2320/matertrans.47.1232 · DOI
  5. Chen, 2016, Investigation on bonding strength of steel/aluminum clad sheet processed by horizontal twin-roll casting, annealing and cold rolling, Mater. Des., 112, 263, 10.1016/j.matdes.2016.09.061 · DOI
  6. Guo, 2011, Intermetallic phase formation in diffusion-bonded Cu/Al laminates, J. Mater, Sci., 46, 2467
  7. Hannech, 2003, Intermetallic formation in the aluminum-copper system, Surf. Rev. Lett., 10, 677, 10.1142/S0218625X03005396 · DOI
  8. Huang, 2017, Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip, T. Nonferr. Metals Soc., 27, 1019, 10.1016/S1003-6326(17)60119-5 · DOI · Paper page
  9. Kim, 2014, Microstructural evaluation of interfacial intermetallic compounds in Cu wire bonding with Al and Au pads, Acta Mater., 64, 356, 10.1016/j.actamat.2013.10.049 · DOI
  10. Lee, 2005, Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing, J. Alloys. Compd., 390, 212, 10.1016/j.jallcom.2004.07.057 · DOI · Paper page
  11. Li, 2011, Interfacial microstructure and mechanical properties of Cu/Al clad sheet fabricated by asymmetrical roll bonding and annealing, Mater. Sci. Eng. A, 529, 485, 10.1016/j.msea.2011.09.087 · DOI · Paper page
  12. Li, 2018, Interfacial bonding mechanism and annealing effect on Cu-Al joint produced by solid-liquid compound casting, J. Mater. Process. Technol., 252, 795, 10.1016/j.jmatprotec.2017.10.050 · DOI · Paper page
  13. Mao, 2018, Interfacial characterization and bonding properties of copper/aluminum clad sheets processed by horizontal twin-roll casting, multi-pass rolling, and annealing, Metals, 8, 645, 10.3390/met8080645 · DOI
  14. Mao, 2019, Interfacial microstructure and bonding strength of copper/aluminum clad sheets produced by horizontal twin-roll casting and annealing, Mater. Res. Express, 6
  15. Pelzer, 2012, High temperature storage reliability investigation of the Al-Cu wire bond interface, Microelectron. Reliab., 52, 1966, 10.1016/j.microrel.2012.06.070 · DOI
  16. Peng, 2000, Rolling strain effects on the interlaminar properties of roll bonded copper/aluminium metal laminates, J. Mater. Sci., 35, 4357, 10.1023/A:1004852806390 · DOI
  17. Sheng, 2011, Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling, Compos. Part B-Eng., 42, 1468, 10.1016/j.compositesb.2011.04.045 · DOI · Paper page
  18. Takasugi, 1985, Electronic and structural studies of grain boundary strength and fracture in L12 ordered alloys-I. On binary A3B alloys, Acta Metall., 33, 1247, 10.1016/0001-6160(85)90236-6 · DOI
  19. Tanaka, 2006, Evaluation of interdiffusion in liquid phase during reactive diffusion between Cu and Al, Mater. Trans., 47, 2480, 10.2320/matertrans.47.2480 · DOI
  20. Tanaka, 2007, Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al, Mater. Sci. Eng. A, 445-446, 355, 10.1016/j.msea.2006.09.047 · DOI
  21. Tseng, 2009, An analysis of the formability of aluminum/copper clad metals with different thicknesses by the finite element method and experiment, Int. J. Adv. Manuf. Tech., 49, 1029, 10.1007/s00170-009-2446-4 · DOI
  22. Yasuhiro, 1971, Interdiffusion in the Al-Cu system, Trans. JIM, 12, 147, 10.2320/matertrans1960.12.147 · DOI
  23. Zhang, 2016, Formation and growth of Cu-Al IMCs and their effect on electrical property of electroplated Cu/Al laminar composites, T. Nonferr. Metal Soc., 26, 3283, 10.1016/S1003-6326(16)64462-X · DOI
  24. Zu, 2017, Interfacial bonding mechanism and mechanical performance of Ti/steel bimetallic clad sheet produced by explosive welding and annealing, Rare Metal Mat. Engy., 46, 906, 10.1016/S1875-5372(17)30120-0 · DOI

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Metadata

Authors
Mao, Z., Xie, J., Wang, A., Wang, W., Ma, D., & Liu, P.
Affiliations
Henan University of Science and Technology (CN)
Corresponding author
Xie, Jingpei
ORCID
Venue
Journal of Materials Processing Technology
Publisher
Elsevier BV
Published
2020-11
Volume
285
Pages
116804
ISSN
0924-0136 (ISSN-L)
DOI
10.1016/j.jmatprotec.2020.116804
OpenAlex
W3034750202
Cited by
73
References
0
Citations by year
2026: 13 · 2025: 12 · 2024: 18 · 2023: 10 · 2022: 9 · 2021: 10 · 2020: 1
FWCI
3.60
Type
journal article
Language
en
Open access
closed
Licence
Locations
Journal of Materials Processing Technology (publishedVersion)
Funders
National Natural Science Foundation of China
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
Keywords
annealing temperature, interfacial microstructure, metallurgical bonding, peel strength, intermetallic compound layer, twin-roll casting, cold rolling, crack propagation, cleavage fracture

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CoChat. (2026). Citation check: Effects of annealing temperature on the interfacial microstructure and bonding strength of Cu/Al clad sheets produced by twin-roll casting and rolling. https://app.cochat.ai/papers/10.1016/j.jmatprotec.2020.116804
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Mao, Z., Xie, J., Wang, A., Wang, W., Ma, D., & Liu, P. (2020). Effects of annealing temperature on the interfacial microstructure and bonding strength of Cu/Al clad sheets produced by twin-roll casting and rolling. Journal of Materials Processing Technology. https://doi.org/10.1016/j.jmatprotec.2020.116804