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Cited by 50Advanced Welding Techniques AnalysisElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties

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Interface strengthening of a roll-bonded two-ply Al/Cu sheet by short annealing

Kim, M.J., Lee, K.S., Han, S.H., Hong, S.I.·2021·Materials Characterization
DOI 10.1016/j.matchar.2021.111021
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Research works printed but not linked: 43

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Metadata

Authors
Kim, M. J., Lee, K. S., Han, S. H., & Hong, S. I.
Affiliations
  • Chungnam National University (KR)
  • Korea Institute of Materials Science (KR)
Corresponding author
Lee, K.S.
ORCID
Han, S.H.
Venue
Materials Characterization
Publisher
Elsevier BV
Published
2021-04
Volume
174
Pages
111021
ISSN
1044-5803 (ISSN-L)
DOI
10.1016/j.matchar.2021.111021
OpenAlex
W3135707298
Cited by
50
References
1
Citations by year
2026: 6 · 2025: 6 · 2024: 18 · 2023: 12 · 2022: 6 · 2021: 2
FWCI
4.06
Type
journal article
Language
en
Open access
closed
Licence
Locations
Materials Characterization (publishedVersion)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
  • Physical Sciences › Engineering › Mechanical Engineering › Intermetallics and Advanced Alloy Properties
Keywords
roll bonding, intermetallic compound layer, Al2Cu, Al4Cu9, interface strengthening, bond strength, peel test, tensile properties, microstructure evolution, dissimilar metal joining

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