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Cited by 40Advanced Welding Techniques AnalysisMicrostructure and mechanical propertiesElectronic Packaging and Soldering Technologies

The DOI matches its Crossref record; 37 of the 37 references it cites were found in a registry or an index.

Interface microstructure evolution and mechanical properties of Al/Cu bimetallic tubes fabricated by a novel friction-based welding technology

Li, Wenya, Wen, Quan, Yang, Xiawei, Wang, Yansong, Gao, Dalu, Wang, Weibin·2017·Materials & Design
DOI 10.1016/j.matdes.2017.08.065
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Overview

Integrity signals

Registry

Crossref · 10.1016/j.matdes.2017.08.065

Cites

37 of 37 references verified0 citation errors · 0 not checkable

Statistics

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Verification

Claims the paper makes

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Claims other papers make about this one

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Citations

Cites

Show all 37 references

Research works printed but not linked: 2

  1. Ma, 2003, Some problems of copper using in air conditioning and refrigeration system, Refrig. Air Cond., 3, 66
  2. Tian, 2008, The research and application of copper clad aluminum tube, Chin. Nonferr. Metals, 7, 68

Cited by

See all 40

Metadata

Authors
Li, W., Wen, Q., Yang, X., Wang, Y., Gao, D., & Wang, W.
Affiliations
Northwestern Polytechnical University (CN)
Corresponding author
Li, Wenya
ORCID
Venue
Materials & Design
Publisher
Elsevier BV
Published
2017-11
Volume
134
Pages
383-393
ISSN
0264-1275 (ISSN-L)
DOI
10.1016/j.matdes.2017.08.065
OpenAlex
W2751770988
Cited by
40
References
37
Citations by year
2025: 5 · 2024: 2 · 2023: 3 · 2022: 7 · 2021: 9 · 2020: 6 · 2019: 2 · 2018: 6
FWCI
2.98
Type
journal article
Language
en
Open access
closed
Licence
www.elsevier.com/tdm/userlicense/1.0/ (tdm)
Locations
  • Materials & Design (publishedVersion)
  • DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
Funders
  • Aviation Science Foundation (20161125002)
  • 111 Project (B08040)
  • National Key Research and Development Program of China (2016YFB0701203, 2016YFB1100104)
Topics
  • Physical Sciences › Engineering › Mechanical Engineering › Advanced Welding Techniques Analysis
  • Physical Sciences › Materials Science › Metals and Alloys › Microstructure and mechanical properties
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
Keywords
interfacial microstructure, intermetallic compounds, Al2Cu, AlCu, solid-state diffusion, rotational speed, bonding mechanism, hardness, fracture behavior, crack propagation, metallurgical bonding

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This page
CoChat. (2026). Citation check: Interface microstructure evolution and mechanical properties of Al/Cu bimetallic tubes fabricated by a novel friction-based welding technology. https://app.cochat.ai/papers/10.1016/j.matdes.2017.08.065
The paper
Li, W., Wen, Q., Yang, X., Wang, Y., Gao, D., & Wang, W. (2017). Interface microstructure evolution and mechanical properties of Al/Cu bimetallic tubes fabricated by a novel friction-based welding technology. Materials & Design. https://doi.org/10.1016/j.matdes.2017.08.065

Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.