Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste
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Softer materials match much better the mechanical properties of the surrounding tissue, and several have shown excellent performance during chronic implantation with only mild to minor foreign body reactions.
“Softer materials match much better the mechanical properties of the surrounding tissue, and several of them have shown excellent performance during chronic implantation, with only mild to minor foreign body reactions (25).”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as [25]
Cites
Wire Bonding in Microelectronics
Yang, J. O. (2011) · Assembly Automation · doi:10.1108/aa.2011.03331daa.013 · Cited by 340 · see citing works
Wire bonding in microelectronics
Harman, G. G. (2010) · Cited by 226 · see citing works
Jagt, J. C. (1998) · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · doi:10.1109/95.705467 · Cited by 158 · see citing works
Single chip bumping and reliability for flip chip processes
Klein, M., Oppermann, H. H., Kalicki, R., et al. (1999) · Microelectronics Reliability · doi:10.1016/s0026-2714(99)00067-0 · Cited by 29 · see citing works
Chuang, C.-L. (2006) · Microelectronic Engineering · doi:10.1016/j.mee.2006.11.005 · Cited by 26 · see citing works
Self-citationReliability of 80 μm pitch flip chip attachment on flex
Palm, P., Määttänen, J., Tuominen, A., et al. (2001) · Microelectronics Reliability · doi:10.1016/s0026-2714(01)00009-9 · Cited by 24 · see citing works
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Giagka, V., & Serdijn, W. A. (2018) · Bioelectronic Medicine · doi:10.1186/s42234-018-0010-y · Cited by 58 · see citing works
- Authors
- Chuang, C.-L., Liao, Q.-A., Li, H.-T., Liao, S.-J., & Huang, G.-S.
- Affiliations
- Chung Shan Medical University Hospital (TW)
- National Chung Cheng University (TW)
- Industrial Technology Research Institute (TW)
- Corresponding author
- Chuang, Cheng-Li
- ORCID
- Chuang, Cheng-Li
- Venue
- Microelectronic Engineering
- Publisher
- Elsevier BV
- Published
- 2010-04
- Volume
- 87
- Issue
- 4
- Pages
- 624-630
- ISSN
- 0167-9317 (ISSN-L)
- OpenAlex
- W2029415494
- Cited by
- 20
- References
- 6
- Citations by year
- 2023: 1 · 2022: 1 · 2020: 1 · 2019: 4 · 2018: 1 · 2017: 3 · 2016: 1 · 2015: 1 · 2013: 1 · 2012: 2
- FWCI
- 1.58
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Microelectronic Engineering (publishedVersion)
- Funders
- National Science Council
- Industrial Technology Research Institute
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Mechanical Engineering › Welding Techniques and Residual Stresses
- Keywords
- bond strength, metallurgical bonding, gold bumps, copper electrode, ultrasonic power, flip-chip packaging, electronic packaging
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
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