The DOI matches its Crossref record; 9 of the 9 references it cites were found in a registry or an index.
A review: On the development of low melting temperature Pb-free solders
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Citations
Cites
(2016) · Alloy Phase Diagrams · doi:10.31399/asm.hb.v03.a0006247 · Cited by 16,046
Hansen, M., Anderko, K., & Salzberg, H. W. (1958) · Journal of The Electrochemical Society · doi:10.1149/1.2428700 · Cited by 14,782
Lead-free Solders in Microelectronics
Abtew, M., & Selvaduray, G. (2000) · Materials Science and Engineering: R: Reports · doi:10.1016/s0927-796x(00)00010-3 · Cited by 1,968
Interfacial reactions between lead-free solders and common base materials
Laurila, T. T., Vuorinen, V., & Kivilahti, J. K. (2005) · Materials Science and Engineering R Reports · doi:10.1016/j.mser.2005.03.001 · Cited by 1,109
Tin–lead (SnPb) solder reaction in flip chip technology
Tu, K. N., & Zeng, K. (2001) · Materials Science and Engineering: R: Reports · doi:10.1016/s0927-796x(01)00029-8 · Cited by 595
Electrical Contacts: Fundamentals, Applications and Technology
Braunović, M., Myshkin, N. K., & Konchits, V. V. (2006) · Cited by 376
Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow
Ma, D., Wang, W. D., & Lahiri, S. K. (2002) · Journal of Applied Physics · doi:10.1063/1.1445283 · Cited by 144
Swenson, D. (2006) · Journal of Materials Science Materials in Electronics · doi:10.1007/s10854-006-9012-8 · Cited by 71
Cho, M. G., Kim, H. Y., Seo, S.-K., & Lee, H. M. (2009) · Applied Physics Letters · doi:10.1063/1.3177335 · Cited by 43
Cited by
A review of lead-free solders for electronics applications
Cheng, S., Huang, C.-M., & Pecht, M. (2017) · Microelectronics Reliability · doi:10.1016/j.microrel.2017.06.016 · Cited by 523
Novel nanostructured thermal interface materials: a review
Hansson, J., Nilsson, T. M. J., Ye, L., & Liu, J. (2018) · International Materials Reviews · doi:10.1080/09506608.2017.1301014 · Cited by 441
Low temperature thin films for next-generation microelectronics (invited)
Schmitz, J. (2018) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2017.11.013 · Cited by 103
Metadata
- Authors
- Kotadia, H. R., Howes, P. D., & Mannan, S. H.
- Venue
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Published
- 2014-06
- Volume
- 54
- Issue
- 6-7
- Pages
- 1253-1273
- ISSN
- 0026-2714 (ISSN-L)
- OpenAlex
- W1968459445
- Cited by
- 476
- References
- 9
- FWCI
- 14.86
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: A review: On the development of low melting temperature Pb-free solders. https://app.cochat.ai/papers/10.1016/j.microrel.2014.02.025
- The paper
- Kotadia, H. R., Howes, P. D., & Mannan, S. H. (2014). A review: On the development of low melting temperature Pb-free solders. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2014.02.025
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
