The DOI matches its Crossref record; 10 of the 10 references it cites were found in a registry or an index.
A review of lead-free solders for electronics applications
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Citations
Cites
A review: On the development of low melting temperature Pb-free solders
Kotadia, H. R., Howes, P. D., & Mannan, S. H. (2014) · Microelectronics Reliability · doi:10.1016/j.microrel.2014.02.025 · Cited by 476
Effect of voids on the reliability of BGA/CSP solder joints
Yunus, M., Srihari, K. “., Pitarresi, J. M., et al. (2003) · Microelectronics Reliability · doi:10.1016/s0026-2714(03)00124-0 · Cited by 154
SiC devices for advanced power and high-temperature applications
Wondrak, W., Held, R., Niemann, E., & Schmid, U. (2001) · IEEE Transactions on Industrial Electronics · doi:10.1109/41.915409 · Cited by 124
Ni, W., Huang, Y., Wang, X., Zhang, J., & Wu, K. (2013) · The Science of The Total Environment · doi:10.1016/j.scitotenv.2013.11.032 · Cited by 109
2007 Proceedings 57th Electronic Components and Technology Conference
(2007) · doi:10.1109/ectc12113.2007 · Cited by 100
High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives
Menon, S., George, E., Osterman, M. D., & PECHT, M. G. (2015) · Journal of Materials Science Materials in Electronics · doi:10.1007/s10854-015-2940-4 · Cited by 91
Self-citationKim, J. Y., Yu, J., & Kim, S. (2009) · Acta Materialia · doi:10.1016/j.actamat.2009.06.060 · Cited by 82
RoHS compliance in safety and reliability critical electronics
George, E., & PECHT, M. G. (2016) · Microelectronics Reliability · doi:10.1016/j.microrel.2016.07.150 · Cited by 54
Self-citationLong-Term Toxicity of 213Bi-Labelled BSA in Mice
Dorso, L., Bigot‐Corbel, E., Abadie, J., Diab, M., Gouard, S., Bruchertseifer, F., Morgenstern, A., Maurel, C., Chérel, M., & Davodeau, F. (2016) · PLoS ONE · doi:10.1371/journal.pone.0151330 · Cited by 22
2016 International Conference on Electronics Packaging (ICEP)
(2016) · doi:10.1109/icep38238.2016 · Cited by 20
Cited by
Kim, D., Nagao, S., Chen, C., Wakasugi, N., Yamamoto, Y., Suetake, A., Takemasa, T., Sugahara, T., & Suganuma, K. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2020.3031670 · Cited by 87
Metadata
- Authors
- Cheng, S., Huang, C.-M., & Pecht, M.
- Venue
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Published
- 2017-08
- Volume
- 75
- Pages
- 77-95
- ISSN
- 0026-2714 (ISSN-L)
- OpenAlex
- W2729640983
- Cited by
- 523
- References
- 10
- FWCI
- 16.56
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: A review of lead-free solders for electronics applications. https://app.cochat.ai/papers/10.1016/j.microrel.2017.06.016
- The paper
- Cheng, S., Huang, C.-M., & Pecht, M. (2017). A review of lead-free solders for electronics applications. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2017.06.016
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
