The DOI matches its Crossref record; 196 of the 196 references it cites were found in a registry or an index.
Thermal conductivity of polymers and polymer nanocomposites
Open accessAbstract
Polymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the low thermal conductivity of polymers is one of the major technological barriers. Enhancing the thermal conductivity of polymers is important for these applications and has become a very active research topic over the past two decades. In this review article, we aim to: 1). systematically summarize the molecular level understanding on the thermal transport mechanisms in polymers in terms of polymer morphology, chain structure and inter-chain coupling; 2). highlight the rationales in the recent efforts in enhancing the thermal conductivity of nanostructured polymers and polymer nanocomposites. Finally, we outline the main advances, challenges and outlooks for highly thermal-conductive polymer and polymer nanocomposites.
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Cites
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Cited by
Mohd Nurazzi, N., Asyraf, M. R. M., Khalina, A., Abdullah, N., Sabaruddin, F. A., Kamarudin, S. H., Ahmad, S., Mahat, A. M., Lee, C. L., Aisyah, H. A., et al. (2021) · Polymers · doi:10.3390/polym13071047 · Cited by 478
Zhang, S.-Y., Zhuang, Q., Zhang, M., Wang, H., Gao, Z., Sun, J.-K., & Yuan, J. (2020) · Chemical Society Reviews · doi:10.1039/c8cs00938d · Cited by 384
Thermal Transport in Conductive Polymer–Based Materials
Xu, X., Zhou, J., & Chen, J. (2020) · Advanced Functional Materials · doi:10.1002/adfm.201904704 · Cited by 224
Bozkaya, O., Arat, E., Gün Gök, Z., Yiğitoğlu, M., & Vargel, İ. (2022) · European Polymer Journal · doi:10.1016/j.eurpolymj.2022.111023 · Cited by 85
Kim, T., Drakopoulos, S. X., Ronca, S., & Minnich, A. J. (2022) · Nature Communications · doi:10.1038/s41467-022-29904-2 · Cited by 63
“[6] Congliang Huang, Xin Qian, and Ronggui Yang.”
Background
Metadata
- Authors
- Huang, C., Qian, X., & Yang, R.
- Venue
- Materials Science and Engineering: R: Reports
- Publisher
- Elsevier BV
- Published
- 2018-10
- Volume
- 132
- Pages
- 1-22
- ISSN
- 0927-796X (ISSN-L)
- OpenAlex
- W2963909807
- Cited by
- 909
- References
- 196
- FWCI
- 25.57
- Type
- journal article
- Language
- en
- Open access
- bronze
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Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
