The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.
Thermal boundary resistance
Abstract
The thermal boundary resistance present at interfaces between helium and solids (Kapitza resistance) and the thermal boundary resistance at interfaces between two solids are discussed for temperatures above 0.1 K. The apparent qualitative differences in the behavior of the boundary resistance at these two types of interfaces can be understood within the context of two limiting models of the boundary resistance, the acoustic mismatch model, which assumes no scattering, and the diffuse mismatch model, which assumes that all phonons incident on the interface will scatter. If the acoustic impedances of the two media in contact are very different, as is the case for helium (liquid or solid) in contact with a solid, then phonon scattering at the interface will reduce the boundary resistance. In the limiting case of diffuse mismatch, this reduction is typically over 2 orders of magnitude. Phonons are very sensitive to surface defects, and therefore the Kapitza resistance is very sensitive to the condition of the interface. For typical solid-solid interfaces, at which the acoustic impedances are less different, the influence of diffuse scattering is relatively small; even for the two limiting cases of acoustic mismatch and diffuse mismatch the predicted boundary resistances differ by very little (\ensuremath{\lesssim} 30%). Consequently, the experimentally determined values are expected to be rather insensitive to the condition of the interface, in agreement with recent observations. Subsurface (bulk) disorder and imperfect physical contact between the solids play far more important roles and led to the irreproducibilities observed in the early measurements of the solid-solid thermal boundary resistance.
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Citations
Cites
Thermal conductivity of amorphous solids above the plateau
Cahill, D. G., & Pohl, R. O. (1987) · Physical Review B · doi:10.1103/physrevb.35.4067 · Cited by 813
Self-citationThermal resistance at interfaces
Swartz, E. T., & Pohl, R. O. (1987) · Applied Physics Letters · doi:10.1063/1.98939 · Cited by 410
Self-citation
Cited by
Cahill, D. G., Ford, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., & Phillpot, S. R. (2003) · Journal of Applied Physics · doi:10.1063/1.1524305 · Cited by 2,825
Emerging challenges and materials for thermal management of electronics
Moore, A. L., & Shi, L. (2014) · Materials Today · doi:10.1016/j.mattod.2014.04.003 · Cited by 2,106
Nanoscale thermal transport. II. 2003–2012
Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., et al. (2014) · Applied Physics Reviews · doi:10.1063/1.4832615 · Cited by 1,763
Interfacial Heat Flow in Carbon Nanotube Suspensions
Huxtable, S. T., Cahill, D. G., Shenogin, S., Xue, L., Ozisik, R., Barone, P., Usrey, M., Strano, M. S., Siddons, G., Shim, M., et al. (2003) · Nature Materials · doi:10.1038/nmat996 · Cited by 1,023
Heat transport in thin dielectric films
Lee, S.-M., & Cahill, D. G. (1997) · Journal of Applied Physics · doi:10.1063/1.363923 · Cited by 732
Metadata
- Authors
- Swartz, E. T., & Pohl, R. O.
- Venue
- Reviews of Modern Physics
- Publisher
- American Physical Society (APS)
- Published
- 1989-07-01
- Volume
- 61
- Issue
- 3
- Pages
- 605-668
- ISSN
- 0034-6861 (ISSN-L)
- OpenAlex
- W1976431068
- Cited by
- 2,924
- References
- 2
- FWCI
- 8.87
- Type
- journal article
- Language
- en
- Open access
- closed
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