Cited by 459Thermal properties of materialsThermography and Photoacoustic TechniquesHeat Transfer and Numerical Methods

Rapid thermal conductivity measurement with a hot disk sensor

He, Yi·2005·Thermochimica Acta

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Crossref · 10.1016/j.tca.2005.06.026

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1 of 1 references verified0 citation errors · 0 not checkable

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  • The systematic errors in the hot disk TPS method for low-k materials arise from discrepancies between the idealized model used for data analysis and the actual heat transfer process.

    “Despite its well-established reliability for a wide variety of common materials, the hot disk TPS method is also known to suffer from a substantial systematic errors when applied to lowk thermal insulation materials, because of the discrepancies between the idealized model used for data analysis and the actual heat transfer process.”
  • The bifilar spiral metal heater together with the dielectric insulation layer are usually approximated by several concentric and equally spaced circular rings with constant power in both analytical and numerical prior models.

    “The bifilar spiral metal heater together with the dielectric insulation layer are usually approximated by several concentric and equally spaced circular rings with constant power in both analytical 3, 32 and numerical 20, 27-31 prior models.”
  • The traditional analytical solution and the corresponding analysis procedure in the standard used in a common commercial software are established based on four assumptions about geometry of the sensor and sample.

    “The traditional analytical solution 3, 32 to the heat transfer problem involved in a TPS measurement of isotropic bulk materials and the corresponding analysis procedure in the standard 9 used in a common commercial software (Hot Disk Thermal Constants Analyzer®) is established based on four assumptions about geometry of the sensor and sample. 3, 32”

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Authors
He, Y.
Venue
Thermochimica Acta
Publisher
Elsevier BV
Published
2005-10
Volume
436
Issue
1-2
Pages
122-129
ISSN
0040-6031 (ISSN-L)
OpenAlex
W153730536
Cited by
459
References
1
Citations by year
2026: 26 · 2025: 33 · 2024: 33 · 2023: 27 · 2022: 39 · 2021: 35 · 2020: 24 · 2019: 30 · 2018: 25 · 2017: 33 · 2016: 27 · 2015: 16 · 2014: 26 · 2013: 23 · 2012: 10
FWCI
3.46
Type
journal article
Language
en
Open access
closed
Locations
Thermochimica Acta (publishedVersion)
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
  • Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
  • Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
Keywords
transient plane source method, thermal conductivity measurement, thermal diffusivity, thermal contact resistance, sample size requirements

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