Rapid thermal conductivity measurement with a hot disk sensor
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The systematic errors in the hot disk TPS method for low-k materials arise from discrepancies between the idealized model used for data analysis and the actual heat transfer process.
“Despite its well-established reliability for a wide variety of common materials, the hot disk TPS method is also known to suffer from a substantial systematic errors when applied to lowk thermal insulation materials, because of the discrepancies between the idealized model used for data analysis and the actual heat transfer process.”
From Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials (2020) · cites this paper as [32]
The bifilar spiral metal heater together with the dielectric insulation layer are usually approximated by several concentric and equally spaced circular rings with constant power in both analytical and numerical prior models.
“The bifilar spiral metal heater together with the dielectric insulation layer are usually approximated by several concentric and equally spaced circular rings with constant power in both analytical 3, 32 and numerical 20, 27-31 prior models.”
From Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials (2020) · cites this paper as [32]
The traditional analytical solution and the corresponding analysis procedure in the standard used in a common commercial software are established based on four assumptions about geometry of the sensor and sample.
“The traditional analytical solution 3, 32 to the heat transfer problem involved in a TPS measurement of isotropic bulk materials and the corresponding analysis procedure in the standard 9 used in a common commercial software (Hot Disk Thermal Constants Analyzer®) is established based on four assumptions about geometry of the sensor and sample. 3, 32”
From Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials (2020) · cites this paper as [32]
Cites
Thermal conductivity measurement from 30 to 750 K: the 3ω method
Cahill, D. G. (1990) · Review of Scientific Instruments · doi:10.1063/1.1141498 · Cited by 1,928 · see citing works
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Thermal Interface Materials: Historical Perspective, Status, and Future Directions
Prasher, R. (2006) · Proceedings of the IEEE · doi:10.1109/jproc.2006.879796 · Cited by 927 · see citing works
Zheng, Q., Kaur, S., Dames, C., & Prasher, R. S. (2020) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2020.119331 · Cited by 162 · see citing works
Theoretical accuracy of anisotropic thermal conductivity determined by transient plane source method
Zhang, H., Li, Y.-M., & Tao, W.-Q. (2017) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2017.01.025 · Cited by 69 · see citing works
Transient measurement apparatus for material thermal conductivity at ultra-low temperature
Zhao, P., Wang, J., & Wang, Q. (2025) · IOP Conference Series: Materials Science and Engineering · doi:10.1088/1757-899x/1327/1/012127 · Cited by 1 · see citing works
An improved platinum probe used for transient plane source method at cryogenic temperatures
Zhao, P., & Wang, Q. (2025) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2025.126207 · Cited by 1 · see citing works
- Authors
- He, Y.
- Venue
- Thermochimica Acta
- Publisher
- Elsevier BV
- Published
- 2005-10
- Volume
- 436
- Issue
- 1-2
- Pages
- 122-129
- ISSN
- 0040-6031 (ISSN-L)
- OpenAlex
- W153730536
- Cited by
- 459
- References
- 1
- Citations by year
- 2026: 26 · 2025: 33 · 2024: 33 · 2023: 27 · 2022: 39 · 2021: 35 · 2020: 24 · 2019: 30 · 2018: 25 · 2017: 33 · 2016: 27 · 2015: 16 · 2014: 26 · 2013: 23 · 2012: 10
- FWCI
- 3.46
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Thermochimica Acta (publishedVersion)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Keywords
- transient plane source method, thermal conductivity measurement, thermal diffusivity, thermal contact resistance, sample size requirements
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
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