Theoretical accuracy of anisotropic thermal conductivity determined by transient plane source method
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Error in TPS measurement comes from two sources: (1) uncertainty in experimental data and selection of time interval for analysis, and (2) deviation of the original idealized analytical heat transfer model from the practical measurement scenario.
“Error in the TPS measurement 20-31 comes from two sources: (1) uncertainty in the experimental data and the selection of time interval for analysis, and (2) deviation of the original idealized analytical heat transfer model 3, 32 from the practical measurement scenario.”
From Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials (2020) · cites this paper as [28]
Several publications investigated the accuracy and performance of commercial TPS devices based on numerical simulations to study the effect of sensors on TPS measurement for bulk or thin film and the error due to thermal radiation in semitransparent sample.
“In the latter aspect, several publications investigated the accuracy and performance of commercial TPS devices based on numerical simulations to study the effect of the sensors on the TPS measurement for bulk or thin film 20, 27-31 and the error due to thermal radiation in semitransparent sample. 17, 33”
From Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials (2020) · cites this paper as [28]
The bifilar spiral metal heater together with the dielectric insulation layer are usually approximated by several concentric and equally spaced circular rings with constant power in both analytical and numerical prior models.
“The bifilar spiral metal heater together with the dielectric insulation layer are usually approximated by several concentric and equally spaced circular rings with constant power in both analytical 3, 32 and numerical 20, 27-31 prior models.”
From Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials (2020) · cites this paper as [28]
Detailed information about the specific fitting and optimization procedure is rarely given in the literature, being typically either described simply as a least square method or not clearly mentioned.
“Detailed information about the specific fitting and optimization procedure is rarely given in the literature, being typically either described simply as a least square method (often without specifying the fitting parameters) 20, 27, 28 or not clearly mentioned. 29”
From Analysis and improvement of the hot disk transient plane source method for low thermal conductivity materials (2020) · cites this paper as [28]
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- Authors
- Zhang, H., Li, Y.-M., & Tao, W.-Q.
- Affiliations
- State Key Laboratory of Mechanical Structure Strength and Vibration (CN)
- Xi'an Jiaotong University (CN)
- Corresponding author
- Tao, Wen-Quan
- Venue
- International Journal of Heat and Mass Transfer
- Publisher
- Elsevier BV
- Published
- 2017-05
- Volume
- 108
- Pages
- 1634-1644
- ISSN
- 0017-9310 (ISSN-L)
- OpenAlex
- W2579409055
- Cited by
- 69
- References
- 23
- Citations by year
- 2026: 5 · 2025: 11 · 2024: 8 · 2023: 8 · 2022: 9 · 2021: 9 · 2020: 7 · 2019: 6 · 2018: 6
- FWCI
- 2.19
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- International Journal of Heat and Mass Transfer (publishedVersion)
- Funders
- Young Scientist Fund
- Major International (Regional) Joint Project of National Natural Science Foundation of China (51606143, 51320105004)
- China Postdoctoral Science Foundation (2016M602814)
- Shaanxi Province Postdoctoral Science Foundation (2016BSHEDZZ133)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Keywords
- transient plane source method, anisotropic thermal conductivity, measurement accuracy, sensor thickness, through-plane thermal conductivity, in-plane thermal conductivity, thermal diffusivity, volumetric heat capacity
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