The DOI matches its Crossref record; 16 of the 16 references it cites were found in a registry or an index.
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
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Citations
Cites
Hansen, M., Anderko, K., & Salzberg, H. W. (1958) · Journal of The Electrochemical Society · doi:10.1149/1.2428700 · Cited by 14,782
The kinetics of precipitation from supersaturated solid solutions
Lifshitz, I. M., & Slyozov, V. V. (1961) · Journal of Physics and Chemistry of Solids · doi:10.1016/0022-3697(61)90054-3 · Cited by 8,433
Diffusional Viscosity of a Polycrystalline Solid
Herring, C. (1950) · Journal of Applied Physics · doi:10.1063/1.1699681 · Cited by 2,487
Lead-free Solders in Microelectronics
Abtew, M., & Selvaduray, G. (2000) · Materials Science and Engineering: R: Reports · doi:10.1016/s0927-796x(00)00010-3 · Cited by 1,968
Diffusion in Solids: Recent Developments
Nowick, A. S., & Burton, J. J. (1975) · Cited by 1,002
Ho, P. S., & Kwok, T. (1989) · Reports on Progress in Physics · doi:10.1088/0034-4885/52/3/002 · Cited by 836
Advances in lead-free electronics soldering
Suganuma, K. (2001) · Current Opinion in Solid State and Materials Science · doi:10.1016/s1359-0286(00)00036-x · Cited by 732
Tin–lead (SnPb) solder reaction in flip chip technology
Tu, K. N., & Zeng, K. (2001) · Materials Science and Engineering: R: Reports · doi:10.1016/s0927-796x(01)00029-8 · Cited by 595
Self-citationStress generation by electromigration
Blech, I. A., & Herring, C. (1976) · Applied Physics Letters · doi:10.1063/1.89024 · Cited by 517
Interdiffusion and reaction in bimetallic Cu-Sn thin films
Tu, K. N. (1973) · Acta Metallurgica · doi:10.1016/0001-6160(73)90190-9 · Cited by 486
Self-citation
Cited by
The challenge of ceramic/metal microcomposites and nanocomposites
Moya, J. S., Lopez-Esteban, S., & Pecharromán, C. (2007) · Progress in Materials Science · doi:10.1016/j.pmatsci.2006.09.003 · Cited by 358
Low temperature thin films for next-generation microelectronics (invited)
Schmitz, J. (2018) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2017.11.013 · Cited by 103
Metadata
- Authors
- Zeng, K., & Tu, K. N.
- Venue
- Materials Science and Engineering: R: Reports
- Publisher
- Elsevier BV
- Published
- 2002-06
- Volume
- 38
- Issue
- 2
- Pages
- 55-105
- ISSN
- 0927-796X (ISSN-L)
- OpenAlex
- W2059523013
- Cited by
- 1,367
- References
- 16
- FWCI
- 58.19
- Type
- journal article
- Language
- en
- Open access
- closed
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Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
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- CoChat. (2026). Citation check: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. https://app.cochat.ai/papers/10.1016/s0927-796x(02)00007-4
- The paper
- Zeng, K., & Tu, K. N. (2002). Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Materials Science and Engineering: R: Reports. https://doi.org/10.1016/s0927-796x(02)00007-4
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
