The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Stress generation by electromigration
Abstract
Stresses in aluminum thin films on TiN were studied in situ by transmission x-ray topography. Stress gradients were seen to build up in thin aluminum films during passage of electrical currents. The stresses are more compressive in the anode regions. These stress gradients seem to be a concomitant of the backflow responsible for the reported threshold in electromigration, and can probably be correlated quantitatively with it.
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Citations
Cites
Electromigration—A brief survey and some recent results
Black, J. R. (1969) · IEEE Transactions on Electron Devices · doi:10.1109/t-ed.1969.16754 · Cited by 1,506
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Yao, S., Cui, J., Cui, Z., & Zhu, Y. (2017) · Nanoscale · doi:10.1039/c6nr09270e · Cited by 174
Metadata
- Authors
- Blech, I. A., & Herring, C.
- Venue
- Applied Physics Letters
- Publisher
- AIP Publishing
- Published
- 1976-08-01
- Volume
- 29
- Issue
- 3
- Pages
- 131-133
- ISSN
- 0003-6951 (ISSN-L)
- 1077-3118
- OpenAlex
- W2095470180
- Cited by
- 517
- References
- 1
- FWCI
- 1.11
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: Stress generation by electromigration. https://app.cochat.ai/papers/10.1063/1.89024
- The paper
- Blech, I. A., & Herring, C. (1976). Stress generation by electromigration. Applied Physics Letters. https://doi.org/10.1063/1.89024
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
