The DOI matches its Crossref record; 11 of the 11 references it cites were found in a registry or an index.
Interfaces and stresses in thin films
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
Mechanical properties of thin films
Nix, W. D. (1989) · Metallurgical Transactions A · doi:10.1007/bf02666659 · Cited by 2,546
Shuttleworth, R. (1950) · Proceedings of the Physical Society. Section A · doi:10.1088/0370-1298/63/5/302 · Cited by 1,115
Surface and interface stress effects in thin films
Cammarata, R. C. (1994) · Progress in Surface Science · doi:10.1016/0079-6816(94)90005-1 · Cited by 950
Stresses and deformation processes in thin films on substrates
Doerner, M. F., & Nix, W. D. (1988) · Critical Reviews in Solid State and Materials Sciences · doi:10.1080/10408438808243734 · Cited by 617
Surface Stress in the Self-Assembly of Alkanethiols on Gold
Berger, R., Delamarche, E., Lang, H. P., Gerber, C., Gimzewski, J. K., Meyer, E., & Güntherodt, H.-J. (1997) · Science · doi:10.1126/science.276.5321.2021 · Cited by 544
Stresses in thin films: The relevance of grain boundaries and impurities
Hoffman, R. W. (1976) · Thin Solid Films · doi:10.1016/0040-6090(76)90453-3 · Cited by 479
On surface stress and surface tension
Mays, C. W., Vermaak, J. S., & Kuhlmann-Wilsdorf, D. (1968) · Surface Science · doi:10.1016/0039-6028(68)90119-2 · Cited by 377
Townsend, P. H., Barnett, D. M., & Brunner, T. A. (1987) · Journal of Applied Physics · doi:10.1063/1.339082 · Cited by 374
Grain Growth and Stress Relief in Thin Films
Chaudhari, P. (1972) · Journal of Vacuum Science and Technology · doi:10.1116/1.1316674 · Cited by 317
Measurements of stress during vapor deposition of copper and silver thin films and multilayers
Shull, A. L., & Spaepen, F. (1996) · Journal of Applied Physics · doi:10.1063/1.363701 · Cited by 233
Self-citation
Cited by
Wearable sensors: modalities, challenges, and prospects
Heikenfeld, J., Jajack, A., Rogers, J., Gutruf, P., Tian, L., Pan, T., Li, R., Khine, M., Kim, J., Wang, J., et al. (2018) · Lab on a Chip · doi:10.1039/c7lc00914c · Cited by 1,434
Wang, X., Zeng, W., Hong, L., Xu, W., Yang, H., Wang, F., Duan, H., Tang, M., & Jiang, H. (2018) · Nature Energy · doi:10.1038/s41560-018-0104-5 · Cited by 499
Indentation across size scales and disciplines: Recent developments in experimentation and modeling
GOULDSTONE, A., CHOLLACOOP, N., DAO, M., LI, J., MINOR, A., & SHEN, Y. (2007) · Acta Materialia · doi:10.1016/j.actamat.2006.08.044 · Cited by 473
Kinetic Model for Dependence of Thin Film Stress on Growth Rate, Temperature, and Microstructure
Chason, E., Shin, J. W., Hearne, S. J., & Freund, L. B. (2012) · Journal of Applied Physics · doi:10.1063/1.4704683 · Cited by 134
A Kinetic Model for Stress Generation in Thin Films Grown from Energetic Vapor Fluxes
Chason, E., Karlson, M., Colin, J. J., Magnfält, D., Sarakinos, K., & Abadias, G. (2016) · Journal of Applied Physics · doi:10.1063/1.4946039 · Cited by 90
Metadata
- Authors
- Spaepen, F.
- Venue
- Acta Materialia
- Publisher
- Elsevier BV
- Published
- 2000-01
- Volume
- 48
- Issue
- 1
- Pages
- 31-42
- ISSN
- 1359-6454 (ISSN-L)
- OpenAlex
- W1993838312
- Cited by
- 531
- References
- 11
- FWCI
- 31.67
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Interfaces and stresses in thin films. https://app.cochat.ai/papers/10.1016/s1359-6454(99)00286-4
- The paper
- Spaepen, F. (2000). Interfaces and stresses in thin films. Acta Materialia. https://doi.org/10.1016/s1359-6454(99)00286-4
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.