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Stresses and deformation processes in thin films on substrates

Doerner, Mary F., Nix, William D.·1988·Critical Reviews in Solid State and Materials Sciences

Abstract

The stresses that develop in thin films on substrates can be detrimental to the reliability of thin film electronic devices. In order to design these devices for improved mechanical reliability, an understanding of the origin of these stresses and the controlling deformation processes in thin films is needed. This review begins with a discussion of the basic techniques used for measuring stresses in thin films and for studying the mechanical properties of thin films. The proposed models for the origin of stresses in thin films are then reviewed. Finally, the effects of microstructure and substrate constraint on thin film deformation processes are discussed.

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Metadata

Authors
Doerner, M. F., & Nix, W. D.
Venue
Critical Reviews in Solid State and Materials Sciences
Published
1988-01
Volume
14
Issue
3
Pages
225-268
ISSN
  • 0161-1593 (ISSN-L)
  • 1040-8436
  • 1547-6561
OpenAlex
W2061976368
Cited by
617
References
0
FWCI
18.20
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Stresses and deformation processes in thin films on substrates. https://app.cochat.ai/papers/10.1080/10408438808243734
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Doerner, M. F., & Nix, W. D. (1988). Stresses and deformation processes in thin films on substrates. Critical Reviews in Solid State and Materials Sciences. https://doi.org/10.1080/10408438808243734

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.