The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.
Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement
Abstract
The formation of three-dimensional (3D) interconnections is essential in integrated circuit packaging technology. However, conventional interconnection methods, including the wire-bonding process, were developed for rigid structures of electronic devices, and they are not applicable to the integration of soft and stretchable electronic devices. Hence, there is a strong demand for 3D interconnection technology that is applicable to soft, stretchable electronic devices. Herein, we introduce the material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions. Liquid-metal-based composites for use as stretchable interconnection materials were developed by uniformly dispersing Pt-decorated carbon nanotubes in a liquid metal matrix. The inclusion of carbon nanotubes in the liquid metal improves the mechanical strength of the composite, thereby overcoming the limitation of the liquid metal that has a low mechanical strength. The composites can be 3D printed with various dimensions: the minimum diameters are about 5 μm and have a breakdown current density comparable to that of metal wires.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
Stretchable, Skin-Mountable, and Wearable Strain Sensors and Their Potential Applications: A Review
Amjadi, M., Kyung, K., Park, I., & Sitti, M. (2016) · Advanced Functional Materials · doi:10.1002/adfm.201504755 · Cited by 3,202
Soft, smart contact lenses with integrations of wireless circuits, glucose sensors, and displays
Park, J., Kim, J., Kim, S.-Y., Cheong, W. H., Jang, J., Park, Y.-G., Na, K., Kim, Y.-T., Heo, J. H., Lee, C. Y., et al. (2018) · Science Advances · doi:10.1126/sciadv.aap9841 · Cited by 671
Self-citationBandodkar, A. J., Jeerapan, I., You, J.-M., Nuñez-Flores, R., & Wang, J. (2016) · Nano Letters · doi:10.1021/acs.nanolett.5b04549 · Cited by 341
Jang, J., Hyun, B. G., Ji, S., Cho, E., An, B. W., Cheong, W. H., & Park, J.-U. (2017) · NPG Asia Materials · doi:10.1038/am.2017.172 · Cited by 184
Self-citation
Cited by
Raman spectroscopy of carbon materials and their composites: Graphene, nanotubes and fibres
Li, Z., Deng, L., Kinloch, I. A., & Young, R. J. (2023) · Progress in Materials Science · doi:10.1016/j.pmatsci.2023.101089 · Cited by 1,117
Attributes, Fabrication, and Applications of Gallium‐Based Liquid Metal Particles
Lin, Y., Genzer, J., & Dickey, M. D. (2020) · Advanced Science · doi:10.1002/advs.202000192 · Cited by 503
Neuro-inspired electronic skin for robots
Liu, F., Deswal, S., Christou, A., Sandamirskaya, Y., Kaboli, M., & Dahiya, R. (2022) · Science Robotics · doi:10.1126/scirobotics.abl7344 · Cited by 300
Liquid Metal‐Based Soft Electronics for Wearable Healthcare
Park, Y., Lee, G., Jang, J., Yun, S. M., Kim, E., & Park, J. (2021) · Advanced Healthcare Materials · doi:10.1002/adhm.202002280 · Cited by 258
Self-citationThree-dimensional flexible electronics using solidified liquid metal with regulated plasticity
Li, G., Zhang, M., Liu, S., Yuan, M., Wu, J., Yu, M., Teng, L., Xu, Z., Guo, J., Li, G., et al. (2023) · Nature Electronics · doi:10.1038/s41928-022-00914-8 · Cited by 258
Metadata
- Authors
- Park, Y.-G., Min, H., Kim, H., Zhexembekova, A., Lee, C. Y., & Park, J.-U.
- Venue
- Nano Letters
- Publisher
- American Chemical Society (ACS)
- Published
- 2019-04-15
- Volume
- 19
- Issue
- 8
- Pages
- 4866-4872
- ISSN
- 1530-6984 (ISSN-L)
- 1530-6992
- OpenAlex
- W2937270910
- Cited by
- 200
- References
- 4
- FWCI
- 7.49
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement. https://app.cochat.ai/papers/10.1021/acs.nanolett.9b00150
- The paper
- Park, Y.-G., Min, H., Kim, H., Zhexembekova, A., Lee, C. Y., & Park, J.-U. (2019). Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement. Nano Letters. https://doi.org/10.1021/acs.nanolett.9b00150
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
