The DOI matches its Crossref record; 40 of the 40 references it cites were found in a registry or an index.
Polymer Capacitor Dielectrics for High Temperature Applications
Abstract
Much effort has been invested for nearly five decades to identify and develop new polymer capacitor dielectrics for higher than ambient temperature applications. Simultaneous demands of processability, dielectric permittivity, thermal conductivity, and dielectric breakdown strength dictated by increasing high power performance criteria limit the number of available materials. The present review first explains the advantages of metallized polymer film capacitors over the film-foil, ceramic, and electrolytic counterparts and then presents a comprehensive review on both past developmental effort of commercial resins and recent research progress on new polymers targeted for operating temperature above 150 °C. Some historical background and discussion on the limitation of the commercially available polymer film dielectrics for high temperature applications are also given. In many cases, further development of promising polymers that appear to possess all or most of the important criteria is limited by lack of large scale market incentives but could be of great value to niche applications in the military or aerospace realm.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
Odian, G. (2004) · doi:10.1002/047147875x · Cited by 7,158
Encyclopedia of polymer science and engineering
Bawn, C. S. H. (1987) · Polymer · doi:10.1016/0032-3861(87)90274-6 · Cited by 4,203
Introduction to Physical Polymer Science
Sperling, L. H. (2005) · doi:10.1002/0471757128 · Cited by 2,917
Stoneham, A. M. (1970) · Physics Bulletin · doi:10.1088/0031-9112/21/12/031 · Cited by 2,628
Anelastic and Dielectric Effects in Polymeric Solids
McCrum, N. G., Read, B. E., & Williams, G. (1991) · Medical Entomology and Zoology · Cited by 2,595
Flexible high-temperature dielectric materials from polymer nanocomposites
Li, Q., Chen, L., Gadinski, M. R., Zhang, S., Zhang, G., Li, H. U., Iagodkine, E., Haque, A., Chen, L.-Q., Jackson, T. N., et al. (2015) · Nature · doi:10.1038/nature14647 · Cited by 2,133
Electrical Degradation and Breakdown in Polymers
Dissado, L. A., & Fothergill, J. C. (1992) · Institution of Engineering and Technology eBooks · doi:10.1049/pbed009e · Cited by 1,795
Prateek, Thakur, V. K., & Gupta, R. K. (2016) · Chemical Reviews · doi:10.1021/acs.chemrev.5b00495 · Cited by 1,659
High temperature proton exchange membranes based on polybenzimidazoles for fuel cells
Li, Q., Jensen, J. O., Savinell, R. F., & Bjerrum, N. J. (2009) · Progress in Polymer Science · doi:10.1016/j.progpolymsci.2008.12.003 · Cited by 1,323
A review on the dielectric materials for high energy-storage application
Hao, X. (2013) · Journal of Advanced Dielectrics · doi:10.1142/s2010135x13300016 · Cited by 1,011
Accelerating materials property predictions using machine learning
Pilania, G., Wang, C., Jiang, X., Rajasekaran, S., & Ramprasad, R. (2013) · Scientific Reports · doi:10.1038/srep02810 · Cited by 853
History and recent progress in piezoelectric polymers
Fukada, E. (2000) · IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control · doi:10.1109/58.883516 · Cited by 650
Polymer-Based Dielectrics with High Energy Storage Density
Chen, Q., Shen, Y., Zhang, S., & Zhang, Q. M. (2015) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-070214-021017 · Cited by 642
Polybenzimidazoles, new thermally stable polymers
Vogel, H. A., & Marvel, C. S. (1961) · Journal of Polymer Science · doi:10.1002/pol.1961.1205015419 · Cited by 604
A brief introduction to ceramic capacitors
Pan, M.-J., & Randall, C. A. (2010) · IEEE Electrical Insulation Magazine · doi:10.1109/mei.2010.5482787 · Cited by 533
Thermal conductivity of polymers
Choy, C. L. (1977) · Polymer · doi:10.1016/0032-3861(77)90002-7 · Cited by 483
State of the art of high temperature power electronics
Buttay, C., Planson, D., Allard, B., Bergogne, D., Bevilacqua, P., Joubert, C., Lazar, M., Martin, C., Morel, H., Tournier, D., et al. (2011) · Materials Science and Engineering: B · doi:10.1016/j.mseb.2010.10.003 · Cited by 432
Advanced polymeric dielectrics for high energy density applications
Huan, T. D., Boggs, S., Teyssedre, G., Laurent, C., Cakmak, M., Kumar, S., & Ramprasad, R. (2016) · Progress in Materials Science · doi:10.1016/j.pmatsci.2016.05.001 · Cited by 387
GaN Transistors for Efficient Power Conversion
Lidow, A., Rooij, M., Strydom, J., Reusch, D., & Glaser, J. (2019) · Wiley eBooks · doi:10.1002/9781119594406 · Cited by 379
A review of high-temperature electronics technology and applications
Watson, J., & Castro, G. (2015) · Journal of Materials Science: Materials in Electronics · doi:10.1007/s10854-015-3459-4 · Cited by 378
Rational design of all organic polymer dielectrics
Sharma, V., Wang, C., Lorenzini, R. G., Ma, R., Zhu, Q., Sinkovits, D. W., Pilania, G., Oganov, A. R., Kumar, S., Sotzing, G. A., et al. (2014) · Nature Communications · doi:10.1038/ncomms5845 · Cited by 335
On the theory of dielectric breakdown in solids
Fröhlich, H. (1947) · Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences · doi:10.1098/rspa.1947.0023 · Cited by 321
An overview of high-temperature electronic device technologies and potential applications
Dreike, P. L., Fleetwood, D. M., King, D. B., Sprauer, D. C., & Zipperian, T. E. (1994) · IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A · doi:10.1109/95.335047 · Cited by 192
Accelerated materials property predictions and design using motif-based fingerprints
Huan, T. D., Mannodi-Kanakkithodi, A., & Ramprasad, R. (2015) · Physical Review B · doi:10.1103/physrevb.92.014106 · Cited by 168
Stille, J. K. (1981) · Macromolecules · doi:10.1021/ma50004a077 · Cited by 153
Ho, J., Ramprasad, R., & Boggs, S. A. (2007) · IEEE Transactions on Dielectrics and Electrical Insulation · doi:10.1109/tdei.2007.4339492 · Cited by 126
Self-citationThe rational design of polyurea & polyurethane dielectric materials
Lorenzini, R. G., Kline, W. M., Wang, C. C., Ramprasad, R., & Sotzing, G. A. (2013) · Polymer · doi:10.1016/j.polymer.2013.05.003 · Cited by 104
Rational design and synthesis of polythioureas as capacitor dielectrics
Ma, R., Sharma, V., Baldwin, A. F., Tefferi, M. B., Offenbach, I., Çakmak, M., Weiss, R. A., Cao, Y., Ramprasad, R., & Sotzing, G. A. (2015) · Journal of Materials Chemistry A · doi:10.1039/c5ta01252j · Cited by 104
Selecting film bus link capacitors for high performance inverter applications
Salcone, M., & Bond, J. (2009) · IEEE International Electric Machines and Drives Conference (IEMDC) · doi:10.1109/iemdc.2009.5075431 · Cited by 98
The History of Polytetrafluoroethylene: Discovery and Development
Plunkett, R. J. (1986) · Springer eBooks · doi:10.1007/978-94-011-7073-4_25 · Cited by 71
Wu, K., Sukumar, N., Lanzillo, N. A., Wang, C., Ramprasad, R., Ma, R., Baldwin, A. F., Sotzing, G. A., & Breneman, C. M. (2016) · Journal of Polymer Science Part B Polymer Physics · doi:10.1002/polb.24117 · Cited by 64
Review of Recent Activities on Dielectric Films for Capacitor Applications
Qi, L., Petersson, L., & Liu, T. (2014) · Journal of International Council on Electrical Engineering · doi:10.5370/jicee.2014.4.1.001 · Cited by 60
Dielectric characteristics of polyimide CP2
Jacobs, J. D., Arlen, M. J., Wang, D. H., Ounaies, Z., Berry, R., Tan, L., Garrett, P. H., & Vaia, R. A. (2010) · Polymer · doi:10.1016/j.polymer.2010.04.072 · Cited by 39
MQSPR modeling in materials informatics: a way to shorten design cycles?
Sukumar, N., Krein, M. P., Luo, Q., & Breneman, C. M. (2012) · Journal of Materials Science · doi:10.1007/s10853-012-6639-0 · Cited by 32
Gupta, S. K., Offenbach, I., Ronzello, J., Cao, Y., Boggs, S. A., Weiss, R. A., & Çakmak, M. (2017) · Journal of Polymer Science Part B Polymer Physics · doi:10.1002/polb.24399 · Cited by 25
FONTANELLA, J. J., Boyles, D. A., Filipova, T. S., Awwad, S. H., Edmondson, C. A., Bendler, J. T., Wintersgill, M. C., Lomax, J. F., & Schroeder, M. J. (2011) · Journal of Polymer Science Part B Polymer Physics · doi:10.1002/polb.23010 · Cited by 15
KEMET film capacitors for high temperature, high voltage and high current
Caliari, L., Bettacchi, P., Boni, E., Montanari, D., Gamberini, A., Barbieri, L., & Bergamaschi, F. (2013) · Cited by 13
Development of Thermoplastic Fluoropolymers
Putnam, R. E. (1986) · Springer eBooks · doi:10.1007/978-94-011-7073-4_27 · Cited by 12
Other polymers used for biaxial films
DeMeuse, M. T. (2011) · Elsevier eBooks · doi:10.1533/9780857092953.1.47 · Cited by 6
Fink, J. K. (2014) · Elsevier eBooks · doi:10.1016/b978-0-323-31222-6.00016-9 · Cited by 1
Metadata
- Authors
- Ho, J. S., & Greenbaum, S. G.
- Venue
- ACS Applied Materials & Interfaces
- Publisher
- American Chemical Society (ACS)
- Published
- 2018-08-06
- Volume
- 10
- Issue
- 35
- Pages
- 29189-29218
- ISSN
- 1944-8244 (ISSN-L)
- 1944-8252
- OpenAlex
- W2886811083
- Cited by
- 404
- References
- 40
- FWCI
- 7.83
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
