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State of the art of high temperature power electronics
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Research works printed but not linked: 17
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Cited by
Polymer Capacitor Dielectrics for High Temperature Applications
Ho, J. S., & Greenbaum, S. G. (2018) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.8b07705 · Cited by 404
Egin Martin, G., Verbrugge, B., Mahedi Hasan, M., El Baghdadi, M., Romano, C., & Hegazy, O. (2025) · IEEE Access · doi:10.1109/access.2025.3612315 · Cited by 8
“Although the SiC devices are theoretically capable of operating at junction temperatures exceeding 400 C, practical constraints related to packaging reliability currently limit commercial operation to approximately 175 C [12].”
Metadata
- Authors
- Buttay, C., Planson, D., Allard, B., Bergogne, D., Bevilacqua, P., Joubert, C., Lazar, M., Martin, C., Morel, H., Tournier, D., & Raynaud, C.
- Venue
- Materials Science and Engineering: B
- Publisher
- Elsevier BV
- Published
- 2011-03
- Volume
- 176
- Issue
- 4
- Pages
- 283-288
- ISSN
- 0921-5107 (ISSN-L)
- OpenAlex
- W2045760679
- Cited by
- 432
- References
- 0
- FWCI
- 7.72
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
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- CoChat. (2026). Citation check: State of the art of high temperature power electronics. https://app.cochat.ai/papers/10.1016/j.mseb.2010.10.003
- The paper
- Buttay, C., Planson, D., Allard, B., Bergogne, D., Bevilacqua, P., Joubert, C., Lazar, M., Martin, C., Morel, H., Tournier, D., & Raynaud, C. (2011). State of the art of high temperature power electronics. Materials Science and Engineering: B. https://doi.org/10.1016/j.mseb.2010.10.003
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
