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Highly Thermal Conductive Copper Nanowire Composites with Ultralow Loading: Toward Applications as Thermal Interface Materials
Abstract
Thermal interface materials (TIMs) are of ever-rising importance with the development of modern microelectronic devices. However, traditional TIMs exhibit low thermal conductivity even at high loading fractions. The use of high-aspect-ratio material is beneficial to achieve low percolation threshold for nanocomposites. In this work, single crystalline copper nanowires with large aspect ratio were used as filling materials for the first time. A thermal conductivity of 2.46 W/mK was obtained at an ultralow loading fraction, ∼0.9 vol %, which was enhanced by 1350% compared with plain matrix. Such an excellent performance makes copper nanowires attractive fillers for high-performance TIMs.
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Cites
Chemistry and Properties of Nanocrystals of Different Shapes
Burda, C., Chen, X., Narayanan, R., & El-Sayed, M. A. (2005) · Chemical Reviews · doi:10.1021/cr030063a · Cited by 7,230
Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
Shahil, K. M. F., & Balandin, A. A. (2012) · Nano Letters · doi:10.1021/nl203906r · Cited by 1,467
Cited by
Thermal conductivity of polymer-based composites: Fundamentals and applications
Chen, H., Ginzburg, V. V., Yang, J., Yang, Y., Liu, W., Huang, Y., Du, L., & Chen, B. (2016) · Progress in Polymer Science · doi:10.1016/j.progpolymsci.2016.03.001 · Cited by 2,049
Zhang, F., Feng, Y., & Feng, W. (2020) · Materials Science and Engineering: R: Reports · doi:10.1016/j.mser.2020.100580 · Cited by 566
Zeng, X., Sun, J., Yao, Y., Sun, R., Xu, J.-B., & Wong, C.-P. (2017) · ACS Nano · doi:10.1021/acsnano.7b02359 · Cited by 523
Self-citationNovel nanostructured thermal interface materials: a review
Hansson, J., Nilsson, T. M. J., Ye, L., & Liu, J. (2018) · International Materials Reviews · doi:10.1080/09506608.2017.1301014 · Cited by 441
Present and future thermal interface materials for electronic devices
Razeeb, K. M., Dalton, E., Cross, G. L. W., & Robinson, A. J. (2018) · International Materials Reviews · doi:10.1080/09506608.2017.1296605 · Cited by 422
Metadata
- Authors
- Wang, S., Cheng, Y., Wang, R., Sun, J., & Gao, L.
- Venue
- ACS Applied Materials & Interfaces
- Publisher
- American Chemical Society (ACS)
- Published
- 2014-04-21
- Volume
- 6
- Issue
- 9
- Pages
- 6481-6486
- ISSN
- 1944-8244 (ISSN-L)
- 1944-8252
- OpenAlex
- W2319222007
- Cited by
- 276
- References
- 2
- FWCI
- 8.49
- Type
- journal article
- Language
- en
- Open access
- closed
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- Wang, S., Cheng, Y., Wang, R., Sun, J., & Gao, L. (2014). Highly Thermal Conductive Copper Nanowire Composites with Ultralow Loading: Toward Applications as Thermal Interface Materials. ACS Applied Materials & Interfaces. https://doi.org/10.1021/am500009p
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