The DOI matches its Crossref record; 1 of the 1 references it cites were found in a registry or an index.
Solvent-Promoted Self-Healing Epoxy Materials
Abstract
Introduction. Epoxy-based thermosets are used in a large variety of structural composites for various applications includ-ing aerospace, automotive, and electronics among others.1 These materials experience stresses through normal use, which can lead to cracking of the epoxy resin.2 Microcracks are often
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Cites
A chiroselective peptide replicator
Saghatelian, A., Yokobayashi, Y., Soltani, K., & Ghadiri, M. R. (2001) · Nature · doi:10.1038/35057238 · Cited by 310
Cited by
Self-Healing Polymers and Composites
Blaiszik, B. J., Kramer, S. L. B., Olugebefola, S. C., Moore, J. S., Sottos, N. R., & White, S. R. (2010) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-070909-104532 · Cited by 1,505
Self-citationAdvanced Materials for Printed Wearable Electrochemical Devices: A Review
Kim, J., Kumar, R., Bandodkar, A. J., & Wang, J. (2017) · Advanced Electronic Materials · doi:10.1002/aelm.201600260 · Cited by 452
Self-Healing Polymeric Materials Using Epoxy/Mercaptan as the Healant
Yuan, Y. C., Rong, M. Z., Zhang, M. Q., Chen, J., Yang, G. C., & Li, X. M. (2008) · Macromolecules · doi:10.1021/ma800028d · Cited by 444
Burattini, S., Greenland, B. W., Hayes, W., Mackay, M. E., Rowan, S. J., & Colquhoun, H. M. (2011) · Chemistry of Materials · doi:10.1021/cm102963k · Cited by 256
A Thermoplastic/Thermoset Blend Exhibiting Thermal Mending and Reversible Adhesion
Luo, X., Ou, R., Eberly, D. E., Singhal, A., Viratyaporn, W., & Mather, P. T. (2009) · ACS Applied Materials & Interfaces · doi:10.1021/am8001605 · Cited by 205
Metadata
- Authors
- Caruso, M. M., Delafuente, D. A., Ho, V., Sottos, N. R., Moore, J. S., & White, S. R.
- Venue
- Macromolecules
- Publisher
- American Chemical Society (ACS)
- Published
- 2007-11-08
- Volume
- 40
- Issue
- 25
- Pages
- 8830-8832
- ISSN
- 0024-9297 (ISSN-L)
- 1520-5835
- OpenAlex
- W2162813240
- Cited by
- 298
- References
- 1
- FWCI
- 13.04
- Type
- journal article
- Language
- en
- Open access
- closed
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
