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Cited by 1,256

The DOI matches its Crossref record; 20 of the 20 references it cites were found in a registry or an index.

Synthesis of Monolayer Hexagonal Boron Nitride on Cu Foil Using Chemical Vapor Deposition

Kim, Ki Kang, Hsu, Allen, Jia, Xiaoting, Kim, Soo Min, Shi, Yumeng, Hofmann, Mario, Nezich, Daniel, Rodriguez-Nieva, Joaquin F., Dresselhaus, Mildred, Palacios, Tomas, Kong, Jing·2012·Nano Letters

Abstract

Hexagonal boron nitride (h-BN) is very attractive for many applications, particularly, as protective coating, dielectric layer/substrate, transparent membrane, or deep ultraviolet emitter. In this work, we carried out a detailed investigation of h-BN synthesis on Cu substrate using chemical vapor deposition (CVD) with two heating zones under low pressure (LP). Previous atmospheric pressure (AP) CVD syntheses were only able to obtain few layer h-BN without a good control on the number of layers. In contrast, under LPCVD growth, monolayer h-BN was synthesized and time-dependent growth was investigated. It was also observed that the morphology of the Cu surface affects the location and density of the h-BN nucleation. Ammonia borane is used as a BN precursor, which is easily accessible and more stable under ambient conditions than borazine. The h-BN films are characterized by atomic force microscopy, transmission electron microscopy, and electron energy loss spectroscopy analyses. Our results suggest that the growth here occurs via surface-mediated growth, which is similar to graphene growth on Cu under low pressure. These atomically thin layers are particularly attractive for use as atomic membranes or dielectric layers/substrates for graphene devices.

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Crossref · 10.1021/nl203249a

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Metadata

Authors
Kim, K. K., Hsu, A., Jia, X., Kim, S. M., Shi, Y., Hofmann, M., Nezich, D., Rodriguez-Nieva, J. F., Dresselhaus, M., Palacios, T., & Kong, J.
Venue
Nano Letters
Published
2011-12-06
Volume
12
Issue
1
Pages
161-166
ISSN
  • 1530-6984 (ISSN-L)
  • 1530-6992
OpenAlex
W1971454708
Cited by
1,256
References
20
FWCI
23.70
Type
journal article
Language
en
Open access
closed

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