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Cited by 319

The DOI matches its Crossref record; 5 of the 5 references it cites were found in a registry or an index.

Thermal Properties of Graphene–Copper–Graphene Heterogeneous Films

Goli, Pradyumna, Ning, Hao, Li, Xuesong, Lu, Ching Yu, Novoselov, Konstantin S., Balandin, Alexander A.·2014·Nano Letters

Abstract

We demonstrated experimentally that graphene-Cu-graphene heterogeneous films reveal strongly enhanced thermal conductivity as compared to the reference Cu and annealed Cu films. Chemical vapor deposition of a single atomic plane of graphene on both sides of 9 μm thick Cu films increases their thermal conductivity by up to 24% near room temperature. Interestingly, the observed improvement of thermal properties of graphene-Cu-graphene heterofilms results primarily from the changes in Cu morphology during graphene deposition rather than from graphene's action as an additional heat conducting channel. Enhancement of thermal properties of graphene-capped Cu films is important for thermal management of advanced electronic chips and proposed applications of graphene in the hybrid graphene-Cu interconnect hierarchies.

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Metadata

Authors
Goli, P., Ning, H., Li, X., Lu, C. Y., Novoselov, K. S., & Balandin, A. A.
Venue
Nano Letters
Published
2014-02-24
Volume
14
Issue
3
Pages
1497-1503
ISSN
  • 1530-6984 (ISSN-L)
  • 1530-6992
OpenAlex
W2029388731
Cited by
319
References
5
FWCI
12.21
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Thermal Properties of Graphene–Copper–Graphene Heterogeneous Films. https://app.cochat.ai/papers/10.1021/nl404719n
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Goli, P., Ning, H., Li, X., Lu, C. Y., Novoselov, K. S., & Balandin, A. A. (2014). Thermal Properties of Graphene–Copper–Graphene Heterogeneous Films. Nano Letters. https://doi.org/10.1021/nl404719n

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

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