Cited by 101Thermal properties of materialsThermal Radiation and Cooling TechnologiesThermoelastic and Magnetoelastic Phenomena

Computational Study of In-Plane Phonon Transport in Si Thin Films

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Wang, Xinjiang, Huang, Baoling·2014·Scientific Reports

Abstract

We have systematically investigated the in-plane thermal transport in Si thin films using an approach based on the first-principles calculations and lattice dynamics. The effects of phonon mode depletion induced by the phonon confinement and the corresponding variation in interphonon scattering, which may be important for the thermal conductivities of ultra-thin films but are often neglected in precedent studies, are considered in this study. The in-plane thermal conductivities of Si thin films with different thicknesses have been predicted over a temperature range from 80 K to 800 K and excellent agreements with experimental results are found. The validities of adopting the bulk phonon properties and gray approximation of surface specularity in thin film studies have been clarified. It is found that in ultra-thin films, while the phonon depletion will reduce the thermal conductivity of Si thin films, its effect is largely offset by the reduction in the interphonon scattering rate. The contributions of different phonon modes to the thermal transport and isotope effects in Si films with different thicknesses under various temperatures are also analyzed.

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  • The obtained coupling factor g at room temperature lies in the order of 10^14 W m−3 K−1, as expected from scattering rates of low-frequency phonons.

    “The obtained coupling factor g lies in the order of 10 14 Wm -3 K -1 , which is expected by the scattering rates of low-frequency phonons [35, 36].”

    From Boundary conditions dictate frequency dependence of thermal conductivity in silicon (2025) · cites this paper as [36]

    The Methods section on phonon–phonon scattering and the Discussion address phonon scattering rates, including those of low-frequency phonons. Neither reports a coupling factor g or relates a value of 10^14 W m−3 K−1 to those rates (searched for the factor, its value, and low-frequency phonon scattering). (LLM, conf=0.77)

    Experimental — accuracy not yet measured

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Authors
Wang, X., & Huang, B.
Affiliations
Hong Kong University of Science and Technology (HK)
Corresponding author
Huang, Baoling
Venue
Scientific Reports
Published
2014-09-17
Volume
4
Issue
1
Pages
6399-6399
ISSN
2045-2322 (ISSN-L)
OpenAlex
W2083691792
Cited by
101
References
4
Citations by year
2026: 5 · 2025: 13 · 2024: 3 · 2023: 6 · 2022: 5 · 2021: 6 · 2020: 7 · 2019: 9 · 2018: 11 · 2017: 12 · 2016: 11 · 2015: 13
FWCI
5.45
Type
journal article
Language
en
Update notices
erratum (2015-01-20)
Open access
Locations
  • Scientific Reports (publishedVersion, cc-by)
  • Europe PMC (PubMed Central) (publishedVersion, cc-by)
  • PubMed Central (publishedVersion, cc-by)
  • PubMed (publishedVersion)
  • Rare & Special e-Zone (The Hong Kong University of Science and Technology) (submittedVersion, cc-by)
Topics
  • Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
  • Physical Sciences › Engineering › Civil and Structural Engineering › Thermal Radiation and Cooling Technologies
  • Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
Keywords
in-plane thermal conductivity, silicon thin films, phonon confinement, ultrathin films, isotope effects, phonon transport, film thickness dependence

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