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Preparation of PVP coated Cu NPs and the application for low-temperature bonding
Abstract
There is an increasing interest in developing a low temperature interconnection process using nanoparticles. Some studies focus on bonding using Ag nanoparticles (Ag NPs). However, few studies investigate a bonding process using Cu nanoparticles (Cu NPs) due to the easy oxidation in air. Here we achieve a robust bonding of Cu wires to Cu pads with polyvinylpyrrolidone (PVP) coated Cu NPs at a low temperature of 170 °C. The PVP coating can effectively prevent the oxidation of Cu NPs when heated in air. The bonding is formed through the sintering of Cu NPs and direct metallic bonding between the sintered Cu particles and Cu pads. Electrical measurements of the Cu NPs demonstrate that Cu NPs have a low resistivity of 8.6 × 10−5 Ω cm after being sintered under pressure. This method has the potential to be used in the electrical packaging industry due to its economic cost, easy operation, and high conductivity.
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Cited by
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
Peng, P., Hu, A., Gerlich, A. P., Zou, G., Liu, L., & Zhou, Y. N. (2015) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.5b02134 · Cited by 364
Self-citationReview of Die-Attach Materials for SiC High-Temperature Packaging
Hou, F., Sun, Z., Su, M., Fan, J., You, X., Li, J., Wang, Q., Cao, L., & Zhang, G. (2024) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2024.3417529 · Cited by 52
Metadata
- Authors
- Jianfeng, Y., Guisheng, Z., Anming, H., & Zhou, Y. N.
- Venue
- Journal of Materials Chemistry
- Publisher
- Royal Society of Chemistry (RSC)
- Published
- 2011
- Volume
- 21
- Issue
- 40
- Pages
- 15981
- ISSN
- 0959-9428 (ISSN-L)
- 1364-5501
- OpenAlex
- W2145413915
- Cited by
- 229
- References
- 0
- FWCI
- 7.35
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: Preparation of PVP coated Cu NPs and the application for low-temperature bonding. https://app.cochat.ai/papers/10.1039/c1jm12108a
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- Jianfeng, Y., Guisheng, Z., Anming, H., & Zhou, Y. N. (2011). Preparation of PVP coated Cu NPs and the application for low-temperature bonding. Journal of Materials Chemistry. https://doi.org/10.1039/c1jm12108a
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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