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Cited by 203

The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.

Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler

Dai, Wen, Yu, Jinhong, Wang, Yi, Song, Yingze, Alam, Fakhr E., Nishimura, Kazuhito, Lin, Cheng-Te, Jiang, Nan·2015·Journal of Materials Chemistry A

Abstract

3DSG incorporated into a polyimide matrix greatly enhanced its thermal conductivity (up to 2.63 W m−1 K−1), approximately a 10-fold enhancement in comparison with that of neat polyimide.

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Crossref · 10.1039/c4ta06417h

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Metadata

Authors
Dai, W., Yu, J., Wang, Y., Song, Y., Alam, F. E., Nishimura, K., Lin, C.-T., & Jiang, N.
Venue
Journal of Materials Chemistry A
Published
2015
Volume
3
Issue
9
Pages
4884-4891
ISSN
  • 2050-7488 (ISSN-L)
  • 2050-7496
OpenAlex
W2014182743
Cited by
203
References
4
FWCI
8.26
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler. https://app.cochat.ai/papers/10.1039/c4ta06417h
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Dai, W., Yu, J., Wang, Y., Song, Y., Alam, F. E., Nishimura, K., Lin, C.-T., & Jiang, N. (2015). Enhanced thermal conductivity for polyimide composites with a three-dimensional silicon carbide nanowire@graphene sheets filler. Journal of Materials Chemistry A. https://doi.org/10.1039/c4ta06417h

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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.