The DOI matches its Crossref record; 46 of the 46 references it cites were found in a registry or an index.
Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity
Abstract
Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during the past decade. However, the conventional method to improve through‐plane thermal conductivity of these polymer composites usually yields an undesired value (below 3.0 Wm−1 K−1). Here, construction of a 3D phonon skeleton is reported composed of stacked boron nitride (BN) platelets reinforced with reduced graphene oxide (rGO) for epoxy composites by the combination of ice‐templated and infiltrating methods. At a low filler loading of 13.16 vol%, the resulting 3D BN‐rGO/epoxy composites exhibit an ultrahigh through‐plane thermal conductivity of 5.05 Wm−1 K−1 as the best thermal‐conduction performance reported so far for BN sheet‐based composites. Theoretical models qualitatively demonstrate that this enhancement results from the formation of phonon‐matching 3D BN‐rGO networks, leading to high rates of phonon transport. The strong potential application for thermal management has been demonstrated by the surface temperature variations of the composites with time during heating and cooling.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
The chemistry of graphene oxide
Dreyer, D. R., Park, S., Bielawski, C. W., & Ruoff, R. S. (2010) · Chem. Soc. Rev. · doi:10.1039/b917103g · Cited by 11,653
Graphene and Graphene Oxide: Synthesis, Properties, and Applications
Zhu, Y., Murali, S., Cai, W., Li, X., Suk, J. W., Potts, J. R., & Ruoff, R. S. (2010) · Advanced Materials · doi:10.1002/adma.201001068 · Cited by 10,522
Yang, D., Velamakanni, A., Bozoklu, G., Park, S., Stoller, M., Piner, R. D., Stankovich, S., Jung, I., Field, D. A., Ventrice, C. A., et al. (2009) · Carbon · doi:10.1016/j.carbon.2008.09.045 · Cited by 3,260
Cahill, D. G., Ford, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., & Phillpot, S. R. (2003) · Journal of Applied Physics · doi:10.1063/1.1524305 · Cited by 2,825
Atomic layers of hybridized boron nitride and graphene domains
Ci, L., Song, L., Jin, C., Jariwala, D., Wu, D., Li, Y., Srivastava, A., Wang, Z. F., Storr, K., Balicas, L., et al. (2010) · Nature Materials · doi:10.1038/nmat2711 · Cited by 2,166
Emerging challenges and materials for thermal management of electronics
Moore, A. L., & Shi, L. (2014) · Materials Today · doi:10.1016/j.mattod.2014.04.003 · Cited by 2,106
Freezing as a Path to Build Complex Composites
Deville, S., Saiz, E., Nalla, R. K., & Tomsia, A. P. (2006) · Science · doi:10.1126/science.1120937 · Cited by 1,900
Zhi, C., Bando, Y., Tang, C., Kuwahara, H., & Golberg, D. (2009) · Advanced Materials · doi:10.1002/adma.200900323 · Cited by 1,756
Lei, W., Mochalin, V. N., Liu, D., Qin, S., Gogotsi, Y., & Chen, Y. (2015) · Nature Communications · doi:10.1038/ncomms9849 · Cited by 861
Ice-templated porous alumina structures
Deville, S., Saiz, E., & Tomsia, A. P. (2007) · Acta Materialia · doi:10.1016/j.actamat.2006.11.003 · Cited by 769
Cited by
Recent Developments in Nanocellulose-Based Aerogels in Thermal Applications: A Review
Ahankari, S., Paliwal, P., Subhedar, A., & Kargarzadeh, H. (2021) · ACS Nano · doi:10.1021/acsnano.0c09678 · Cited by 281
Yang, J., Tang, L.-S., Bai, L., Bao, R.-Y., Liu, Z.-Y., Xie, B.-H., Yang, M.-B., & Yang, W. (2019) · Materials Horizons · doi:10.1039/c8mh01219a · Cited by 269
Wang, T., Li, M., Xu, H., Wang, X., Jia, M., Hou, X., Gao, S., Liu, Q., Yang, Q., Tian, M., et al. (2024) · Nano-Micro Letters · doi:10.1007/s40820-024-01433-1 · Cited by 118
Metadata
- Authors
- Yao, Y., Sun, J., Zeng, X., Sun, R., Xu, J., & Wong, C.
- Venue
- Small
- Publisher
- Wiley
- Published
- 2018-02-02
- Volume
- 14
- Issue
- 13
- Pages
- e1704044-e1704044
- ISSN
- 1613-6810 (ISSN-L)
- 1613-6829
- OpenAlex
- W2793717938
- Cited by
- 389
- References
- 46
- FWCI
- 16.63
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity. https://app.cochat.ai/papers/10.1002/smll.201704044
- The paper
- Yao, Y., Sun, J., Zeng, X., Sun, R., Xu, J., & Wong, C. (2018). Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity. Small. https://doi.org/10.1002/smll.201704044
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.