High temperature thermal management with boron nitride nanosheets
Abstract
The rapid development of high power density devices requires more efficient heat dissipation.
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The variable spot size TDTR approach has been successfully applied to layered two-dimensional materials and bulk crystals.
“This method has then been successfully applied in several studies of anisotropic materials including both layered two-dimensional materials (such as transition metal dichalcogenides 35 and their alloys 192 and boron nitride nanosheets 193 ) and bulk crystals (such as silicon carbide 33 ).”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [193]
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- Authors
- Wang, Y., Xu, L., Yang, Z., Xie, H., Jiang, P., Dai, J., Luo, W., Yao, Y., Hitz, E., Yang, R., Yang, B., & Hu, L.
- Affiliations
- University of Maryland, College Park (US)
- University of Colorado Boulder (US)
- Corresponding author
- Hu, Liangbing
- ORCID
- Venue
- Nanoscale
- Publisher
- Royal Society of Chemistry (RSC)
- Published
- 2018
- Volume
- 10
- Issue
- 1
- Pages
- 167-173
- ISSN
- 2040-3364 (ISSN-L)
- 2040-3372
- OpenAlex
- W2770373491
- Cited by
- 66
- References
- 54
- Citations by year
- 2026: 7 · 2025: 3 · 2024: 8 · 2023: 7 · 2022: 6 · 2021: 4 · 2020: 13 · 2019: 11 · 2018: 7
- FWCI
- 3.58
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Nanoscale (publishedVersion)
- PubMed (publishedVersion)
- Funders
- Office of Naval Research (ONR YIP, Program Manager: Sarwat Chappell)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Materials Science › Materials Chemistry › Boron and Carbon Nanomaterials Research
- Physical Sciences › Engineering › Mechanical Engineering › Heat Transfer and Boiling Studies
- Keywords
- boron nitride nanosheets, thermal management, heat dissipation, integrated circuits, high-power devices, hot spot mitigation, thermal interface materials
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